1-169

XXX

YWW

87

65

4

3

2

1

PIN

ONE

7°

5.842 ± 0.203

(0.236 ± 0.008)

3.937 ± 0.127

(0.155 ± 0.005)

0.381 ± 0.076

(0.016 ± 0.003)

1.270

(0.050)

BSG

5.080 ± 0.005

(0.200 ± 0.005)

3.175 ± 0.127

(0.125 ± 0.005)

1.524

(0.060)

45° X 0.432

(0.017)

0.228 ± 0.025

(0.009 ± 0.001)

0.152 ± 0.051

(0.006 ± 0.002)

TYPE NUMBER (LAST 3 DIGITS)

DATE CODE

DIMENSIONS IN MILLIMETERS AND (INCHES).

LEAD COPLANARITY = 0.10 mm (0.004 INCHES).

0.305

(0.012)

MIN.

Note: Use of Nonchlorine Activated Fluxes is Recommended.

240

∆T = 115°C, 0.3°C/SEC

0

∆T = 100°C, 1.5°C/SEC

∆T = 145°C, 1°C/SEC

TIME – MINUTES

220

200

180

160

140

120

100

80

60

40

20

0

260

12

3

456789

10

11

12

HCPL-061A/061N/063A/063N Outline Drawing

Figure 3. 8-Pin Small Outline Package Device Drawing.

Solder Reflow Temperature Profile (HCPL-06XX and Gull Wing Surface Mount

Option 300 Parts)

Regulatory Information

The HCPL-261A and HCPL-261N

families have been approved by

the following organizations:

UL

Recognized under UL 1577,

Component Recognition

Program, File E55361.

CSA

Approved under CSA Component

Acceptance Notice #5, File CA

88324.

VDE

Approved according to VDE

0884/06.92. (HCPL-261A/261N

Option 060 only)