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AD5315ARM Datasheet(PDF) 7 Page - Analog Devices |
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AD5315ARM Datasheet(HTML) 7 Page - Analog Devices |
7 / 24 page AD5305/AD5315/AD5325 Rev. G | Page 7 of 24 ABSOLUTE MAXIMUM RATINGS TA = 25°C, unless otherwise noted. Table 4. Parameter1 Rating VDD to GND –0.3 V to +7 V SCL, SDA to GND –0.3 V to VDD + 0.3 V A0 to GND –0.3 V to VDD + 0.3 V Reference Input Voltage to GND –0.3 V to VDD + 0.3 V VOUTA to VOUTD to GND –0.3 V to VDD + 0.3 V Operating Temperature Range Industrial (A, B Version) −40°C to +105°C Storage Temperature Range −65°C to +150°C Junction Temperature (TJ max) 150°C MSOP Power Dissipation (TJ max − TA)/θJA θJA Thermal Impedance 206°C/W θJC Thermal Impedance 44°C/W Reflow Soldering Peak Temperature 220°C Time at Peak Temperature 10 sec to 40 sec 1 Transient currents of up to 100 mA do not cause SCR latcth-up. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ESD CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. |
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