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AD8216 Datasheet(PDF) 5 Page - Analog Devices |
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AD8216 Datasheet(HTML) 5 Page - Analog Devices |
5 / 16 page Data Sheet AD8216 Rev. B | Page 5 of 16 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS 1 2 3 5 6 7 8 Figure 2. Metallization Diagram –IN 1 GND 2 VREF2 3 NC 4 +IN 8 VREF1 7 V+ 6 OUT 5 NC = NO CONNECT AD8216 TOP VIEW (Not to Scale) Figure 3. Pin Configuration Table 3. Pin Function Descriptions Pin No. Mnemonic X Y 1 −IN −320 +390 2 GND −357 +14 3 VREF2 −349 −201 4 NC NC NC 5 OUT +348 −325 6 V+ +349 −194 7 VREF1 +349 −26 8 +IN +318 +390 Die size is 1100 μm by 1035 μm. Die thickness is 13 mil. Minimum passivation opening (minimum bond pad size) is 92 μm × 92 μm. Passivation type is 8 kA USG (Oxide) + 10 kA Oxynitride. Bond pad metal composition is 98.5% Al, 1% Si, and 0.5% Cu. Backside potential is V+. |
Número de pieza similar - AD8216_15 |
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Descripción similar - AD8216_15 |
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