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AD9254BCPZ-150 Datasheet(PDF) 7 Page - Analog Devices

No. de pieza AD9254BCPZ-150
Descripción Electrónicos  14-Bit, 150 MSPS, 1.8 V Analog-to-Digital Converter
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Fabricante Electrónico  AD [Analog Devices]
Página de inicio  http://www.analog.com
Logo AD - Analog Devices

AD9254BCPZ-150 Datasheet(HTML) 7 Page - Analog Devices

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AD9254
Rev. 0 | Page 7 of 40
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
Rating
ELECTRICAL
AVDD to AGND
−0.3 V to +2.0 V
DRVDD to DGND
−0.3 V to +3.9 V
AGND to DGND
−0.3 V to +0.3 V
AVDD to DRVDD
−3.9 V to +2.0 V
D0 through D13 to DGND
−0.3 V to DRVDD + 0.3 V
DCO to DGND
−0.3 V to DRVDD + 0.3 V
OR to DGND
−0.3 V to DRVDD + 0.3 V
CLK+ to AGND
−0.3 V to +3.9 V
CLK− to AGND
−0.3 V to +3.9 V
VIN+ to AGND
−0.3 V to AVDD + 0.2 V
VIN− to AGND
−0.3 V to AVDD + 0.2 V
VREF to AGND
−0.3 V to AVDD + 0.2 V
SENSE to AGND
−0.3 V to AVDD + 0.2 V
REFT to AGND
−0.3 V to AVDD + 0.2 V
REFB to AGND
−0.3 V to AVDD + 0.2 V
SDIO/DCS to DGND
−0.3 V to DRVDD + 0.3 V
PDWN to AGND
−0.3 V to +3.9 V
CSB to AGND
−0.3 V to +3.9 V
SCLK/DFS to AGND
−0.3 V to +3.9 V
OEB to AGND
−0.3 V to +3.9 V
ENVIRONMENTAL
Storage Temperature Range
–65°C to +125°C
Operating Temperature Range
–40°C to +85°C
Lead Temperature
(Soldering 10 Sec)
300°C
Junction Temperature
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
The exposed paddle must be soldered to the ground plane for
the LFCSP_VQ package. Soldering the exposed paddle to the
customer board increases the reliability of the solder joints,
maximizing the thermal capability of the package.
Table 6. Thermal Resistance
Package Type
θJA
θJC
Unit
48-lead LFCSP_VQ (CP-48-3)
26.4
2.4
°C/W
Typical θJA and θJC are specified for a 4-layer board in still air.
Airflow increases heat dissipation, effectively reducing θJA. In
addition, metal in direct contact with the package leads from
metal traces and through holes, ground, and power planes,
reduces the θJA.
ESD CAUTION


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