ADA4304-3/ADA4304-4

Rev. 0 | Page 4 of 12

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

Supply Voltage

5.5 V

Power Dissipation

See Figure 3

Storage Temperature Range

−65°C to +125°C

Operating Temperature Range

−40°C to +85°C

Lead Temperature (Soldering, 10 sec)

300°C

Junction Temperature

150°C

Stresses above those listed under Absolute Maximum

Ratings may cause permanent damage to the device. This is

a stress rating only; functional operation of the device at

these or any other conditions above those indicated in the

operational section of this specification is not implied.

Exposure to absolute maximum rating conditions for

extended periods may affect device reliability.

THERMAL RESISTANCE

soldered to a high thermal conductivity 4-layer (2s2p)

circuit board, as described in EIA/JESD 51-7.

Table 3. Thermal Resistance

Package Type

Unit

16-Lead LFCSP (Exposed Pad)

98

°C/W

Maximum Power Dissipation

The maximum safe power dissipation in the ADA4304-3/

ADA4304-4 package is limited by the associated rise in

150°C, which is the glass transition temperature, the plastic

changes its properties. Even temporarily exceeding this

temperature limit can change the stresses that the package

exerts on the die, permanently shifting the parametric

performance. Exceeding a junction temperature of 150°C

for an extended period can result in changes in the silicon

devices, potentially causing failure.

power dissipation of the ADA4304-3/ADA4304-4 can be

calculated as

In addition, more metal directly in contact with the package

leads/exposed pad from metal traces, through-holes, ground,

Figure 3 shows the maximum safe power dissipation in the

package vs. the ambient temperature for the 16-lead LFCSP

(98°C/W) on a JEDEC standard 4-layer board.

0

0

100

AMBIENT TEMPERATURE (°C)

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

10

20

30

40

50

60

70

80

90

Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board

ESD CAUTION