CYStech Electronics Corp.

Spec. No. : C884N3

Issued Date : 2014.08.20

Revised Date :

Page No. : 2/ 9

MTB030N04N3

CYStek Product Specification

Parameter

Symbol

Limits

Unit

Drain-Source Voltage

40

V

Gate-Source Voltage

±20

8

A

4.6

(Note 3)

4.7

(Note 3)

3.8

32

Maximum Power Dissipation

3

W

1

1.25

0.8

Operating Junction and Storage Temperature

Tj, Tstg

-55~+175

C

Thermal Performance

Parameter

Symbol

Limit

Unit

Thermal Resistance, Junction-to-Ambient , max

(Note 3)

100

C/W

Thermal Resistance, Junction-to-Case , max

50

Note: 1. Pulse width limited by maximum junction temperature.

2. Pulse width≤300μs, duty cycle≤2%

3. Surface mounted on 1 in²copper pad of FR-4 board at steady state; 417C/W when mounted on minimum copper

pad.

in setting the upper dissipation limit for cases where additional heatsinking is used.

in any given application depends on the user’s specific board design, and the maximum temperature of 175°C may

be used if the PCB allows it.

Symbol

Min.

Typ.

Max.

Unit

Test Conditions

Static

40

-

-

V

-

32

-

mV/℃

1.0

-

2.5

V

-

9.1

-

S

-

-

±100

nA

-

-

1

μA

-

-

50

C

-

-

150

C

-

25.3

34

m



-

-

47

C

-

-

65

C

-

34.2

46