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ADN2890 Datasheet(PDF) 10 Page - Analog Devices |
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ADN2890 Datasheet(HTML) 10 Page - Analog Devices |
10 / 12 page ADN2890 Data Sheet Rev. A | Page 10 of 12 PCB Layout Figure 9 shows a recommended PC board layout. Use of 50 Ω transmission lines is required for all high frequency input and output signals to minimize reflections: PIN, NIN, OUTP and OUTN. It is also necessary for the PIN/NIN input traces to be matched in length, and OUTP/OUTN output traces to be matched in length to avoid skew between the differential traces. C1, C2, C3, and C4 are ac-coupling capacitors in series with the high speed I/O. It is recommended that components be used such that the pad for the capacitor is the same width as the transmission line in order to minimize the mismatch in the 50 Ω transmission line at the capacitor’s pads. It is recommended that the trans- mission lines not change layers through vias, if possible. For supply decoupling, the 1 nF decoupling capacitor should be placed on the same layer as the ADN2890 as close as possible to the VCC pin. The 0.1 µF capacitor can be placed on the bottom of the PCB directly underneath the 1 nF decoupling capacitor. All high speed CML outputs are back-terminated on chip with 50 Ω resistors connected between the output pin and VCC. The high speed inputs, PIN and NIN, are internally terminated with 50 Ω to an internal reference voltage. As with any high speed mixed-signal design, take care to keep all high speed digital traces away from sensitive analog nodes. Soldering Guidelines for Chip Scale Package The lands on the 16 LFCSP are rectangular. The printed circuit board pad for these should be 0.1 mm longer than the package land length and 0.05 mm wider than the package land width. The land should be centered on the pad. This ensures that the solder joint size is maximized. The bottom of the chip scale package has a central exposed pad. The pad on the printed circuit board should be at least as large as this exposed pad. The user must connect the exposed pad to VEE using filled vias so that solder does not leak through the vias during reflow. This ensures a solid connection from the exposed pad to VEE. Figure 9. Recommended ADN2890 PCB Layout 1 VIAS TO GND EXPOSED PAD PIN NIN VIA TO C12, R2 ON BOTTOM C11 VIA TO BOTTOM DOUBLE-VIA TO GND TO REDUCE INDUCTANCE C3 C8 C4 C1 C6 C2 OUTP DOUBLE-VIAS TO REDUCE INDUCTANCE TO SUPPLY AND GND R1, C9, C10 ON BOTTOM TO ROSA PLACE C7 ON BOTTOM OF BOARD UNDERNEATH C8 OUTN PLACE C5 ON BOTTOM OF BOARD UNDERNEATH C6 ∼4mm |
Número de pieza similar - ADN2890_15 |
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Descripción similar - ADN2890_15 |
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