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ISL3690IR-TK Datasheet(PDF) 1 Page - Intersil Corporation

No. de pieza ISL3690IR-TK
Descripción Electrónicos  Dual Band Direct Conversion Transceiver
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Fabricante Electrónico  INTERSIL [Intersil Corporation]
Página de inicio  http://www.intersil.com/cda/home
Logo INTERSIL - Intersil Corporation

ISL3690IR-TK Datasheet(HTML) 1 Page - Intersil Corporation

  ISL3690IR-TK Datasheet HTML 1Page - Intersil Corporation  
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®
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143
| Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2002. All Rights Reserved. PRISM® is a registered trademark of Intersil Corporation.
PRISM logo is a trademark of Intersil Corporation. Microsoft® and Windows® are registered trademarks of Microsoft Corporation.
ISL3690
Dual Band Direct Conversion Transceiver
The Intersil ISL3690 is a highly
integrated UHF2 process, DUAL
BAND direct conversion transceiver
and is part of a 2.4/5.2GHz, IEEE802.11a/b/g compliant
radio chipset. The ISL3690 directly interfaces with Intersil’s
ISL3890 Medium Access Controller with Integrated
Baseband processor. The addition of Intersil’s ISL3990
power amplifier and ISL3090 10GHz VCO completes a
WLAN transceiver application.
Pinout
ISL3690 (QFN)
TOP VIEW
Features
• Highly integrated Dual Band RF to baseband solution
• Frequency of operation . 2.4 to 2.5GHz or 5.15 to 5.35GHz
• Low supply operation . . . . . . . . . . . . . . . . . . . . 2.7 to 3.3V
• Noise figure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.4dB
• TX OFDM Output Power . . . . . . . . . . . . . . . . . . . . .-5dBm
• TX I/Q MTPR, PAR=12 . . . . . . . . . . . . . . . . . . . . . . -45dB
• RX Voltage gain . . . . . . . . . . . . . . . . . . . . . . . . . 0 to 74dB
• RX I/Q MTPR, PAR=12, High Gain . . . . . . . . . . . . . -35dB
• TX/RX switching speed . . . . . . . . . . . . . . . . . . . . . . . <1µs
• Direct simple interface to ISL3890
• QFN Package:
- Compliant to JEDEC PUB95 MO-220
QFN - Quad Flat No Leads - Package Outline
- Near Chip Scale Package footprint, which improves
PCB efficiency and has a thinner profile
Applications
• PC card wireless LAN adapters
• High data rate wireless LAN systems targeting
IEEE802.11 a/b/g standards
• Spread spectrum Dual Band WLAN RF modems
• TDMA or CSMA packet protocol Dual Band radios
• PCI wireless LAN cards
• ISA, ISA PnP WLAN cards
LNA_VCC
LNA_GND
LB_LNA_IN-
LB_SHIELD
LB_LNA_IN+
HB_SHIELD
TX_I+
TX_Q+
TX_Q-
LB_TX_OUT+
LB_TX_OUT-
TX_I-
TX_VCC2
TX_GND
PRE_VDD
LD/RREF
RX_I+
RX_I-
RX_AGC_GND
RX_Q-
RX_Q+
RX_AGC_VCC
1.2V_REF
LE
PRE_GND
DATA
HB_LNA_IN-
HB_LNA_IN+
HB_TX_OUT+
HB_TX_OUT- 29
28
27
26
25
24
23
22
21
20
19
31
30
32
18
17
61
60
59
58
57
56
55
54
53
52
51
63
62
64
50
49
HB_SHIELD_2
TX_VCC1
RX_I
RX_Q
BB_OVLD
VREF
LB
2
I
Q
2
I
Q
I SELECT
Q SELECT
RX I
TX I
RX Q
TX Q
LB
TX_I
TX_Q
CP
SERIAL INTER.
2
10GHz
LO
REF IN
TX_DET
SYNTHESIZER
Ordering Information
PART NUMBER
TEMP. RANGE
(oC)
PACKAGE
PKG. NO.
ISL3690IR
-40 to 85
64 Ld QFN
L64.9x9
ISL3690IR-TK
Tape and Reel
Data Sheet
March 2003
FN8046


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