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UPD178004A Datasheet(PDF) 47 Page - NEC

No. de pieza UPD178004A
Descripción Electrónicos  8-BIT SINGLE-CHIP MICROCONTROLLERS
Download  56 Pages
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Fabricante Electrónico  NEC [NEC]
Página de inicio  http://www.nec.com/
Logo NEC - NEC

UPD178004A Datasheet(HTML) 47 Page - NEC

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µPD178004A, 178006A, 178016A, 178018A
12. RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the conditions recommended in the table below.
For detail of recommended soldering conditions, refer to the information document Semiconductor Device
Mounting Technology Manual (C10535E).
For soldering methods and conditions other than those recommended below, contact an NEC sales representative.
Table 12-1. Surface Mounting Type Soldering Conditions
µPD178004AGC-×××-3B9 : 80-pin plastic QFP (14 × 14 mm, 0.65 mm pitch)
µPD178006AGC-×××-3B9 : 80-pin plastic QFP (14 × 14 mm, 0.65 mm pitch)
µPD178016AGC-×××-3B9 : 80-pin plastic QFP (14 × 14 mm, 0.65 mm pitch)
µPD178018AGC-×××-3B9 : 80-pin plastic QFP (14 × 14 mm, 0.65 mm pitch)
Package peak temperature: 235
°C, Duration: 30 sec. max. (at 210 °C or above),
Number of times: Three times max.
Package peak temperature: 215
°C, Duration: 40 sec. max. (at 200 °C or above),
Number of times: Three times max.
Solder bath temperature : 260
°C max., Duration : 10 sec. max., Number of times
: once, Preheating temperature : 120
°C max.
(package surface temperature)
Pin temperature: 300
°C max. Duration: 3 sec. max. (per pin row)
Infrared reflow
VPS
Wave soldering
Partial heating
IR35-00-3
VP15-00-3
WS60-00-1
Recommended
Condition Symbol
Soldering Conditions
Soldering Method
Caution Do not use different soldering method together (except for partial heating).


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