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DMN30H4D0L-7 Datasheet(PDF) 2 Page - Diodes Incorporated |
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DMN30H4D0L-7 Datasheet(HTML) 2 Page - Diodes Incorporated |
2 / 6 page DMN30H4D0L Document number: DS36313 Rev. 2 - 2 2 of 6 www.diodes.com February 2014 © Diodes Incorporated DMN30H4D0L Maximum Ratings (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Units Drain-Source Voltage VDSS 300 V Gate-Source Voltage VGSS ±20 V Continuous Drain Current (Note 6) VGS = 10V Steady State TA = +25°C TA = +70°C ID 0.25 0.20 A Pulsed Drain Current (10μs pulse, duty cycle ≦1%) IDM 2 A Maximum Body Diode Continuous Current (Note 6) IS 0.8 A Thermal Characteristics (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Units Total Power Dissipation (Note 5) PD 0.31 W (Note 6) 0.47 Thermal Resistance, Junction to Ambient (Note 5) RJA 377 °C/W (Note 6) 255 Thermal Resistance, Junction to Case (Note 6) RJC 81 Operating and Storage Temperature Range TJ, TSTG -55 to 150 °C Electrical Characteristics (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Min Typ Max Unit Test Condition OFF CHARACTERISTICS (Note 7) Drain-Source Breakdown Voltage BVDSS 300 V VGS = 0V, ID = 250µA Zero Gate Voltage Drain Current IDSS 1.0 µA VDS = 240V, VGS = 0V Gate-Body Leakage IGSS ±100 nA VGS = ±20V, VDS = 0V ON CHARACTERISTICS (Note 7) Gate Threshold Voltage VGS(th) 1 3 V VDS = VGS, ID = 250 µA Static Drain-Source On-Resistance RDS(ON) 2.1 4 Ω VGS = 10V, ID = 0.3A 2.1 4 VGS = 4.5V, ID = 0.2A 3.8 6 VGS = 2.7V, ID = 0.1A Diode Forward Voltage VSD 0.7 1.2 V VGS = 0V, IS = 0.3A DYNAMIC CHARACTERISTICS (Note 8) Input Capacitance Ciss 187.3 pF VDS = 25V, VGS = 0V, f = 1.0MHz Output Capacitance Coss 11.7 Reverse Transfer Capacitance Crss 8.7 Total Gate Charge Qg 7.6 nC VDS = 192V, VGS = 10V, ID = 0.5A Gate-Source Charge Qgs 0.5 Gate-Drain Charge Qgd 3.3 Turn-On Delay Time tD(on) 4.9 nS VDS = 60V, RL =200Ω VGS = 10V, RG = 25Ω Turn-On Rise Time tr 4.7 Turn-Off Delay Time tD(off) 25.8 Turn-Off Fall Time tf 17.5 Notes: 5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided. 6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper pad layout 7 .Short duration pulse test used to minimize self-heating effect. 8. Guaranteed by design. Not subject to production testing. |
Número de pieza similar - DMN30H4D0L-7 |
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Descripción similar - DMN30H4D0L-7 |
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