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BUJD203AX Datasheet(PDF) 5 Page - NXP Semiconductors

No. de pieza BUJD203AX
Descripción Electrónicos  NPN power transistor with integrated diode
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Fabricante Electrónico  PHILIPS [NXP Semiconductors]
Página de inicio  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

BUJD203AX Datasheet(HTML) 5 Page - NXP Semiconductors

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BUJD203AX
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 01 — 27 September 2010
5 of 14
NXP Semiconductors
BUJD203AX
NPN power transistor with integrated diode
5.
Thermal characteristics
6.
Isolation characteristics
Table 5.
Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Rth(j-h)
thermal resistance from
junction to heatsink
with heatsink compound; see Figure 5
--4.8
K/W
Rth(j-a)
thermal resistance from
junction to ambient
in free air
-
55
-
K/W
Fig 5.
Transient thermal impedance from junction to heatsink as a function of pulse duration
001aag169
10−2
10−1
1
10
Zth(j-h)
(K/W)
10−3
tp (s)
10−6
102
10
10−3
10−5
1
10−1
10−2
10−4
tp
tp
1/f
P
t
1/f
δ =
δ = 0.5
0.2
0.1
0.05
0.02
0
Table 6.
Isolation characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Visol(RMS)
RMS isolation voltage
50 Hz
≤ f ≤ 60 Hz; RH ≤ 65 %; Th =25°C;
from all terminals to external heatsink; clean
and dust free
-
-
2500
V
Cisol
isolation capacitance
Th = 25 °C; f = 1 MHz; from collector to
external heatsink
-10
-
pF


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