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IRLI530NPBF Datasheet(PDF) 1 Page - International Rectifier |
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IRLI530NPBF Datasheet(HTML) 1 Page - International Rectifier |
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1 / 9 page  IRLI530NPbF HEXFET® Power MOSFET PD - 95635 S D G VDSS = 100V RDS(on) = 0.10Ω ID = 12A l Logic-Level Gate Drive l Advanced Process Technology l Isolated Package l High Voltage Isolation = 2.5KVRMS
l Sink to Lead Creepage Dist. = 4.8mm l Fully Avalanche Rated l Lead-Free TO-220 FULLPAK 07/23/04 Parameter Typ. Max. Units RθJC Junction-to-Case 3.7 RθJA Junction-to-Ambient 65 Thermal Resistance Parameter Max. Units ID @ TC = 25°C Continuous Drain Current, VGS @ 10V 12 ID @ TC = 100°C Continuous Drain Current, VGS @ 10V 8.6 A IDM Pulsed Drain Current 60 PD @TC = 25°C Power Dissipation 41 W Linear Derating Factor 0.27 W/°C VGS Gate-to-Source Voltage ± 16 V EAS Single Pulse Avalanche Energy 150 mJ IAR Avalanche Current 9.0 A EAR Repetitive Avalanche Energy 4.1 mJ dv/dt Peak Diode Recovery dv/dt 5.0 V/ns TJ Operating Junction and -55 to + 175 TSTG Storage Temperature Range Soldering Temperature, for 10 seconds 300 (1.6mm from case ) °C Mounting torque, 6-32 or M3 screw 10 lbfin (1.1Nm) Absolute Maximum Ratings °C/W Description Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications. The TO-220 Fullpak eliminates the need for additional insulating hardware in commercial-industrial applications. The moulding compound used provides a high isolation capability and a low thermal resistance between the tab and external heatsink. This isolation is equivalent to using a 100 micron mica barrier with standard TO-220 product. The Fullpak is mounted to a heatsink using a single clip or by a single screw fixing. www.irf.com 1 |
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