AMC1203

www.ti.com

SBAS427C

– FEBRUARY 2008 – REVISED JUNE 2011

THERMAL CHARACTERISTICS

(1)

Over recommended operating conditions, unless otherwise noted.

PARAMETER

SOP-8 GULL-WING

SOP-8

SOIC-16

UNIT

Low-K

127

246

104

°C/W

Junction-to-air thermal resistance

High-K

78

164

58

°C/W

Junction-to-case thermal resistance

61

32

25

°C/W

Device power dissipation (max)

110

110

110

mW

(1)

Tested in accordance with the Low-K or High-K thermal metric definitions of EIA/JESD51-3 for leaded surface mount packages.

RECOMMENDED OPERATING CONDITIONS

Over operating free-air temperature range, unless otherwise noted.

PARAMETER

MIN

NOM

MAX

UNIT

4.5

5.0

5.5

V

0

V

–280

280

mV

–40

+125

°C

DISSIPATION RATINGS

(1)

DERATING FACTOR

PACKAGE

POWER RATING

POWER RATING

POWER RATING

POWER RATING

SOP-8 Gull-Wing

7.9mW/

°C

984mW

629mW

511mW

354mW

SOP-8

4.1mW/

°C

508mW

325mW

264mW

182mW

SOIC-16

9.6mW/

°C

1201mW

769mW

625mW

432mW

(1)

Based on Low-K thermal resistance.

REGULATORY INFORMATION

VDE

UL

Certified according to IEC 60747-5-2

Recognized under 1577 Component Recognition Program

File Number: 40014131

File Number: E181974

IEC 60747-5-2 ISOLATION CHARACTERISTICS

Over recommended operating conditions, unless otherwise noted.

PARAMETER

TEST CONDITIONS

VALUE

UNIT

Maximum working insulation voltage

560

V

Method A, after input or safety test (subgroup 2 or 3),

672

V

Method A, after environmental test (subgroup 1),

Input to output test voltage

896

V

1050

V

100% production test with t = 1s, partial discharge

< 5pC

Transient overvoltage

t = 60s

4000

V

Isolation resistance

Ω

PD

Pollution degree

2

Copyright

© 2008–2011, Texas Instruments Incorporated

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