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LM5025D Datasheet(PDF) 5 Page - Texas Instruments |
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LM5025D Datasheet(HTML) 5 Page - Texas Instruments |
5 / 31 page LM5025D www.ti.com SNVSAB0 – JUNE 2015 6 Specifications 6.1 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) (2) MIN MAX UNIT VIN to GND –0.3 105 V VCC to GND –0.3 16 V CS1, CS2 to GND –0.3 7 V All other inputs to GND –0.3 7 V Junction Temperature 150 °C Storage temperature, Tstg –55 150 °C (1) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications. (2) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6.2 ESD Ratings VALUE UNIT Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(2) ±2000 V(ESD) Electrostatic discharge(1) V Charged-device model (CDM), per JEDEC specification JESD22- ±500 C101(3) (1) For detailed information on soldering plastic TSSOP package, refer to the Packaging Data Book. (2) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 500-V HBM is possible with the necessary precautions. Pins listed as ±2000 V may actually have higher performance. (3) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VIN Input Voltage 13 90 V External Voltage Applied to VCC 8 15 V Operating Junction Temperature –40 125 °C 6.4 Thermal Information TSSOP THERMAL METRIC(1) UNIT 16 PINS RθJA Junction-to-ambient thermal resistance 95.9 RθJC(top) Junction-to-case (top) thermal resistance 27.0 RθJB Junction-to-board thermal resistance 41.0 °C/W ψJT Junction-to-top characterization parameter 1.1 ψJB Junction-to-board characterization parameter 40.4 RθJC(bot) Junction-to-case (bottom) thermal resistance n/a (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Copyright © 2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: LM5025D |
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