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AME8502 Datasheet(PDF) 6 Page - Analog Microelectronics |
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AME8502 Datasheet(HTML) 6 Page - Analog Microelectronics |
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6 / 20 page  AME 6 AME8502 Rev. A.01 µµµµµProcessor Supervisory n Thermal Information * Measure θ JC on center of molding compound if IC has no tab. ** MIL-STD-202G 210F. Parameter Package Die Attach Symbol Maximum Unit SOT-23 TSOT-23A 81 SOT-143 130 SOT-23 SOT-25 140 TSOT-23A TSOT-25A 130 SC-70-4 120 SOT-23 260 TSOT-23A 230 SOT-143 350 SOT-23 SOT-25 280 TSTO-23A TSOT-25A 250 SC-70-4 400 SOT-23 400 TSOT-23A 455 SOT-143 285 SOT-23 SOT-25 400 TSTO-23A TSOT-25A 400 SC-70-4 300 260 oC Thermal Resistance* (Junction to Case) Conductive Epoxy θJC oC / W Non-Conductive Epoxy mW Non-Conductive Epoxy Thermal Resistance (Junction to Ambient) Conductive Epoxy θJA oC / W Non-Conductive Epoxy Lead Temperature ( soldering 10 sec)** Internal Power Dissipation Conductive Epoxy PD |
Número de pieza similar - AME8502 |
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Descripción similar - AME8502 |
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