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LMS4684 Datasheet(PDF) 10 Page - Texas Instruments

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No. de pieza LMS4684
Descripción Electrónicos  0.5Ohm Low-Voltage, Dual SPDT Analog Switch
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Fabricante Electrónico  TI [Texas Instruments]
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LMS4684 Datasheet(HTML) 10 Page - Texas Instruments

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VIN
V
+
GND
NO
NC
V
+
COM
0.047 PF
LMS4684
SNOSAL0C – DECEMBER 2004 – REVISED APRIL 2013
www.ti.com
Figure 19. Using the LMS4684 at higher frequencies
PCB LAYOUT AND THERMAL CONSIDERATIONS
Both the WSON and DSBGA packages offer enhanced board real estate savings because of their small
footprints. These tiny packages are capable of handling high continuous currents because of the advanced
package thermal handling capabilities.
The WSON package has the exposed die attach pad internally connected to the internal circuit GND. When this
pad is soldered to copper on the PCB board according to Application Note AN-1187, the full thermal capability of
the WSON package can be achieved without additional bulky heat sinks to dissipate the heat generated. The
DSBGA package has a similar capability to dissipate heat through Bumps B2 and C2, which are not electrically
connected. To enhance heat dissipation of the DSBGA package B2 and C2 could be connected to the GND pin
through copper traces on the board.
See Application Note AN-1112 for DSBGA package considerations.
10
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