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LMS4684 Datasheet(PDF) 10 Page - Texas Instruments |
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LMS4684 Datasheet(HTML) 10 Page - Texas Instruments |
10 / 18 page VIN V + GND NO NC V + COM 0.047 PF LMS4684 SNOSAL0C – DECEMBER 2004 – REVISED APRIL 2013 www.ti.com Figure 19. Using the LMS4684 at higher frequencies PCB LAYOUT AND THERMAL CONSIDERATIONS Both the WSON and DSBGA packages offer enhanced board real estate savings because of their small footprints. These tiny packages are capable of handling high continuous currents because of the advanced package thermal handling capabilities. The WSON package has the exposed die attach pad internally connected to the internal circuit GND. When this pad is soldered to copper on the PCB board according to Application Note AN-1187, the full thermal capability of the WSON package can be achieved without additional bulky heat sinks to dissipate the heat generated. The DSBGA package has a similar capability to dissipate heat through Bumps B2 and C2, which are not electrically connected. To enhance heat dissipation of the DSBGA package B2 and C2 could be connected to the GND pin through copper traces on the board. See Application Note AN-1112 for DSBGA package considerations. 10 Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated Product Folder Links: LMS4684 |
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