0

0.5

1

1.5

2

2.5

3

3.5

4

1

3

5

7

9

11

13

15

Output Current (A)

0.4

0.5

0.6

0.7

0.8

0.9

1

1.1

1.2

1.3

1.4

−50

−25

0

25

50

75

100

125

150

Junction Temperature (ºC)

0

5

10

15

20

0

10

20

30

40

50

60

70

80

90

Ambient Temperature (ºC)

400LFM

200LFM

100LFM

Nat Conv

0

5

10

15

20

0

10

20

30

40

50

60

70

80

90

Ambient Temperature (ºC)

400LFM

200LFM

100LFM

Nat Conv

0

5

10

15

20

0

20

40

60

80

100

120

140

Board Temperature (ºC)

CSD87331Q3D

SLPS283A

– SEPTEMBER 2011 – REVISED JANUARY 2012

www.ti.com

TYPICAL POWER BLOCK DEVICE CHARACTERISTICS

otherwise.

Figure 1. Power Loss vs Output Current

Figure 2. Power Loss vs Temperature

Figure 3. Safe Operating Area

Figure 4. Safe Operating Area

(1)

The Typical Power Block System Characteristic curves are based on measurements made on a PCB design with

dimensions of 4.0

” (W) × 3.5” (L) × 0.062” (H) and 6 copper layers of 1 oz. copper thickness. See Application Section

for detailed explanation.

4

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