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LMP2021 Datasheet(PDF) 4 Page - Texas Instruments |
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LMP2021 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 36 page LMP2021, LMP2022 SNOSAY9F – SEPTEMBER 2008 – REVISED DECEMBER 2014 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings (1) (2) MIN MAX UNIT VIN Differential –VS VS Supply Voltage (VS = V + – V−) 6.0 V All Other Pins V+ + 0.3 V− − 0.3 V Output Short-Circuit Duration to V+ or V−(3) 5 seconds Junction Temperature(4) 150 °C Soldering Infrared or Convection (20 sec) 235 °C Information Wave Soldering Lead Temperature (10 sec) 260 °C Tstg Storage temperature range −65 150 °C (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Recommended Operating Conditions indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test conditions, see the Electrical Characteristics Tables. (2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications. (3) Package power dissipation should be observed. (4) The maximum power dissipation is a function of TJ(MAX), θJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) - TA)/ θJA. All numbers apply for packages soldered directly onto a PC board. 6.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 Charged device model (CDM), per JEDEC specification JESD22-C101, ±1000 V(ESD) Electrostatic discharge V all pins(2) Machine model ±200 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT Temperature Range −40 125 °C Supply Voltage (VS = V + – V–) 2.2 5.5 V 6.4 Thermal Information LMP2021, LMP2021 LMP2022 LMP2022 THERMAL METRIC(1) UNIT D DBV DGK 8 PINS 5 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 106 164 217 °C/W (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2008–2014, Texas Instruments Incorporated Product Folder Links: LMP2021 LMP2022 |
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