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LM2931-N Datasheet(PDF) 4 Page - Texas Instruments

No. de pieza LM2931-N
Descripción Electrónicos  LM2931-N Series Low Dropout Regulators
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Fabricante Electrónico  TI [Texas Instruments]
Página de inicio  http://www.ti.com
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LM2931-N Datasheet(HTML) 4 Page - Texas Instruments

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LM2931-N
SNOSBE5G – MARCH 2000 – REVISED APRIL 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS
(1) (2)
Input Voltage
Operating Range
26V
Overvoltage Protection
LM2931A, LM2931C (Adjustable)
60V
LM2931-N
50V
Internal Power Dissipation
(3) (4)
Internally Limited
Operating Ambient Temperature
Range
−40°C to +85°C
Maximum Junction Temperature
125°C
Storage Temperature Range
−65°C to +150°C
Lead Temp. (Soldering, 10 seconds)
230°C
ESD Tolerance (5)
2000V
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when
operating the device beyond its rated operating conditions.
(2)
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3)
See circuit in Typical Applications. To ensure constant junction temperature, low duty cycle pulse testing is used.
(4)
The maximum power dissipation is a function of maximum junction temperature TJmax, total thermal resistance θJA, and ambient
temperature TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJmax − TA)/θJA. If this dissipation is
exceeded, the die temperature will rise above 150°C and the LM2931-N will go into thermal shutdown. For the LM2931-N in the TO-92
package,
θJA is 195°C/W; in the SOIC-8 package, θJA is 160°C/W, and in the TO-220 package, θJA is 50°C/W; in the DDPAK/TO-263
package,
θJA is 73°C/W; and in the 6-Bump DSBGA package θJA is 290°C/W. If the TO-220 package is used with a heat sink, θJA is the
sum of the package thermal resistance junction-to-case of 3°C/W and the thermal resistance added by the heat sink and thermal
interface.If the TO-263 package is used, the thermal resistance can be reduced by increasing the P.C. board copper area thermally
connected to the package: Using 0.5 square inches of copper area,
θJA is 50°C/W; with 1 square inch of copper area, θJA is 37°C/W;
and with 1.6 or more square inches of copper area,
θJA is 32°C/W.
(5)
Human body model, 100 pF discharged through 1.5 k
Ω.
ELECTRICAL CHARACTERISTICS FOR FIXED 3.3V VERSION
VIN = 14V, IO = 10mA, TJ = 25°C, C2 = 100μF (unless otherwise specified)
(1)
LM2931-N-3.3
Parameter
Conditions
Units
Limit
Typ
(2)
Output Voltage
3.3
3.465
VMAX
3.135
VMIN
4V
≤ VIN ≤ 26V, IO = 100 mA
3.630
VMAX
−40°C ≤ TJ ≤ 125°C
2.970
VMIN
Line Regulation
4V
≤ VIN ≤ 26V
4
33
mVMAX
Load Regulation
5mA
≤ IO ≤ 100mA
10
50
mVMAX
Output Impedance
100mADC and 10mArms,
200
m
Ω
100Hz - 10kHz
Quiescent Current
IO ≤ 10mA, 4V ≤ VIN ≤ 26V
0.4
1.0
mAMAX
−40°C ≤ TJ ≤ 125°C
IO = 100mA, VIN = 14V, TJ = 25°C
15
mA
Output Noise Voltage
10Hz -100kHz, COUT = 100μF
330
μVrms
Long Term Stability
13
mV/1000 hr
Ripple Rejection
fO = 120Hz
80
dB
(1)
See circuit in Typical Applications. To ensure constant junction temperature, low duty cycle pulse testing is used.
(2)
All limits are specified for TJ = 25°C (standard type face) or over the full operating junction temperature range of −40°C to +125°C (bold
type face).
4
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