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LM2936 Datasheet(PDF) 4 Page - Texas Instruments |
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LM2936 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 34 page LM2936 SNOSC48O – JUNE 2000 – REVISED DECEMBER 2014 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings (1) (2) MIN MAX UNIT Input voltage (survival) −50 60 V Power dissipation (3) Internally limited Junction temperature (TJMAX) 150 °C Storage temperature, Tstg −65 150 (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not apply when operating the device beyond its specified operating ratings. (2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications. (3) The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) − TA) / RθJA. If this dissipation is exceeded, the die temperature can rise above the TJ(MAX) of 150°C, and the LM2936 may go into thermal shutdown. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. . 6.3 Recommended Operating Conditions MIN MAX UNIT Temperature, TJ −40 125 °C Input voltage, VIN , LM2936 5.5 40 V Input voltage, VIN , LM2936HV only 5.5 60 V Shutdown pin voltage, VSD, LM2936BM only 0 40 V 6.4 Thermal Information LM2936 SOIC (D) TO-252 VSSOP SOT-223 TO-92 (LP) THERMAL METRIC(1) UNIT (NDP) (DGK) (DCY) 8 PINS 3 PINS 8 PINS 4 PINS 3 PINS RθJA Junction-to-ambient thermal resistance 111.4 50.5 173.4 62.8 156.8 RθJC(top) Junction-to-case (top) thermal resistance 56.3 52.6 65.9 44.2 80.4 RθJB Junction-to-board thermal resistance 51.9 29.7 94.9 11.7 n/a °C/W ψJT Junction-to-top characterization parameter 10.9 4.8 9.6 3.6 24.5 ψJB Junction-to-board characterization parameter 51.4 29.3 93.3 11.6 136.0 RθJC(bot) Junction-to-case (bottom) thermal resistance n/a 1.6 n/a n/a n/a (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2000–2014, Texas Instruments Incorporated Product Folder Links: LM2936 |
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