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LM2937IMP-8.0/NOPB Datasheet(PDF) 4 Page - Texas Instruments |
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LM2937IMP-8.0/NOPB Datasheet(HTML) 4 Page - Texas Instruments |
4 / 30 page LM2937 SNVS100F – MARCH 2000 – REVISED JULY 2014 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings (1) (2) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT Continuous 26 Input voltage (VIN) V Transient (t ≤ 100 ms) 60 Internal power dissipation(3) Internally limited Maximum junction temperature 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. (3) The maximum allowable power dissipation at any ambient temperature is PMAX = (125°C − TA)/RθJA, where 125 is the maximum junction temperature for operation, TA is the ambient temperature, and RθJA is the junction-to-ambient thermal resistance. If this dissipation is exceeded, the die temperature will rise above 125°C and the electrical specifications do not apply. If the die temperature rises above 150°C, the LM2937 will go into thermal shutdown. 6.2 Handling Ratings MIN MAX UNIT Tstg Storage temperature range −65 150 °C Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all –2000 2000 V(ESD) Electrostatic discharge V pins(1) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions (1) over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT LM2937ET (NDE), LM2937ES (KTT) −40 125 Junction temperature (TJ) (2) °C LM2937IMP (DCY) −40 85 Input voltage (VIN) VOUT + 1V 26 V (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) The maximum allowable power dissipation at any ambient temperature is PMAX = (125°C − TA)/RθJA, where 125°C is the maximum junction temperature for operation, TA is the ambient temperature, and RθJA is the junction-to-ambient thermal resistance. If this dissipation is exceeded, the die temperature will rise above 125°C and the electrical specifications do not apply. If the die temperature rises above 150°C, the LM2937 will go into thermal shutdown. 6.4 Thermal Information LM2937 THERMAL METRIC(1) NDE(2) KTT DCY UNIT 3 PINS 3 PINS 4 PINS RθJA Junction-to-ambient thermal resistance 77.9 41.8 58.3 RθJC(top) Junction-to-case (top) thermal resistance 35.5 43.5 39.2 RθJB Junction-to-board thermal resistance 70.6 0.8 N/A °C/W ψJT Junction-to-top characterization parameter 13 23.5 7 ψJB Junction-to-board characterization parameter 70.6 10.3 1.6 RθJC(bot) Junction-to-case (bottom) thermal resistance 1 22.5 22.5 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. (2) Thermal information for the TO-220 package is for a free-standing package vertically mounted in the middle of a PCB which is compliant to the JEDEC HIGH-K 2s2p (JESD51-7) specifications. No additional heat sink is attached. See Heatsinking TO-220 Package Parts section for more information. 4 Submit Documentation Feedback Copyright © 2000–2014, Texas Instruments Incorporated Product Folder Links: LM2937 |
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