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LM2650 Datasheet(PDF) 4 Page - Texas Instruments |
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LM2650 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 19 page LM2650 SNVS133C – JUNE 1999 – REVISED APRIL 2013 www.ti.com Absolute Maximum Ratings (1) (2) (All voltages are referenced to the PGND and GND pins.) DC Voltage at PVIN and VIN 20V DC Voltage at SD, SLEEP LOGIC and SYNC 15V DC current into SW ±7.5A Junction Temperature Limited by the IC DC Power Dissipation(3) 1.28W Storage Temperature −65°C to +150°C Soldering Time, Temperature(4) Wave (4 seconds) 260°C Infrared (10 seconds) 240°C Vapor Phase (75 seconds) 219°C ESD Susceptibility(5) 1.3 kV (1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which the device operates correctly. Operating ratings do not imply performance limits. For performance limits and associated test conditions, see the Electrical Characteristics. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. (3) This rating is calculated using the formula PDCmax = (TJmax − TA) / θJA, where PDCmax is the absolute maximum power dissipation, TJmax is the maximum junction temperature, and θJA is the junction ot ambient thermal resistance of the package. The PDCmax rating of 1.28W results from substituting 170°C, 70°C and 78°C/W for TJmax, TA and θJA respectively. A θJAof 78°C represents the worst condition of no heat sinking of the DW0024B small-outline package. Heat sinking allows the safe dissipation of more power. See Application Notes on thermal management. The LM2650 actively limits its junction temperature to about 170°C. (4) For detailed information on soldering plastic small-outline packages, refer to the Packaging Databook published by Texas Instruments. (5) ESD is applied using the human-body model, a 100pF capacitor discharged through a 1.5k Ω resistor. Operating Ratings (1) Supply Voltage Range (PVIN and VIN) 4.5V to 18V Junction Temperature Range −40°C to +125°C (1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which the device operates correctly. Operating ratings do not imply performance limits. For performance limits and associated test conditions, see the Electrical Characteristics. Electrical Characteristics VPVIN = 15V, VSLEEP LOGIC = 0V and VSD = 0V unless superseded under Conditions. Typicals and limits appearing in plain type apply for TA = TJ = +25°C. Limits appearing in boldface type apply over the full junction temperature range shown under Operating Ratings. Symbol Parameter Conditions Typ(1) Limit(2) Units VOUT Output Voltage R1 = 75 k Ω, 1%, 5.00 V R2 = 25 k Ω, 1%, 4.80/4.75 V(min) 7.5V ≤ VPVIN ≤ 18V 5.20/5.25 V(max) 0.12A ≤ ILOAD ≤ 3A η1 System Efficiency ILOAD = 1A, TA = 25°C, 94 % FOSC Not Adjusted η2 System Efficiency ILOAD = 3A, TA = 25°C, 89 % FOSC Not Adjusted VREF Reference Voltage VSLEEPLOGIC = 3V (3) 1.281/1.294 V(min) 1.25 1.219/1.206 V(max) IQ Quiescent Current in PWM mode VFB = VREF 4.0 mA −20mV(4) 6.50/7.0 mA(max) IQS Quiescent Current in Sleep mode IVFB = VREF −20mV, 850 μA VSLEEPLOGIC = 3V (4) 1.35/1.60 mA(max) (1) A typical is the center of characterization data taken at TA = TJ = 25°C. (2) Tested at TA = TJ = 125°C and statistical correlation for room temperature and cold limits. (3) VREF is measured at SLEEP OUT ADJ. (4) Quiescent current is the total current flowing into the PVIN and VIN pins. IQ includes the current used to drive the gates of the two NMOS power FETs at the nominal switching frequency. IQS includes no such current. 4 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM2650 |
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