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LM2736 Datasheet(PDF) 4 Page - Texas Instruments |
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LM2736 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 36 page LM2736 SNVS316H – SEPTEMBER 2004 – REVISED DECEMBER 2014 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VIN -0.5 22 V SW Voltage -0.5 22 V Boost Voltage -0.5 28 V Boost to SW Voltage -0.5 8 V FB Voltage -0.5 3 V EN Voltage -0.5 VIN + 0.3 V Junction Temperature 150 °C Infrared/Convection Reflow (15sec) 220 °C Soldering Information Wave Soldering Lead temperature (10sec) 260 °C Tstg Storage temperature -65 150 °C (1) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. 6.2 ESD Ratings VALUE UNIT Human body model (HBM), V(ESD) Electrostatic discharge ±2000 V per ANSI/ESDA/JEDEC JS-001, all pins(1) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VIN 3 18 V SW Voltage -0.5 18 V Boost Voltage -0.5 23 V Boost to SW Voltage 1.6 5.5 V Junction Temperature Range −40 125 °C 6.4 Thermal Information LM2736 THERMAL METRIC(1) DDC UNIT 6 PINS RθJA (2) Junction-to-ambient thermal resistance 158.1 RθJC(top) Junction-to-case (top) thermal resistance 46.5 RθJB Junction-to-board thermal resistance 29.5 °C/W ψJT Junction-to-top characterization parameter 0.8 ψJB Junction-to-board characterization parameter 29.2 RθJC(bot) Junction-to-case (bottom) thermal resistance n/a (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. (2) Thermal shutdown will occur if the junction temperature exceeds 165°C. The maximum power dissipation is a function of TJ(MAX) , θJA and TA . The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) – TA)/θJA . All numbers apply for packages soldered directly onto a 3” x 3” PC board with 2oz. copper on 4 layers in still air. For a 2 layer board using 1 oz. copper in still air, θJA = 204°C/W. 4 Submit Documentation Feedback Copyright © 2004–2014, Texas Instruments Incorporated Product Folder Links: LM2736 |
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