LM2776

SNVSA56 – MAY 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

Supply voltage (VIN to GND, or GND to VOUT)

6

V

EN

(GND

− 0.3)

V

VOUT continuous output current

250

mA

(3)

125

°C

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(3)

6.2 ESD Ratings

VALUE

UNIT

±1000

V

Electrostatic

discharge

±250

V

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Junction temperature

–40

125

°C

Ambient temperature

-40

85

°C

Input voltage

2.7

5.5

V

Output current

0

200

mA

6.4 Thermal Information

LM2776

DBV (SOT)

UNIT

6 PINS

Junction-to-ambient thermal resistance

187

Junction-to-case (top) thermal resistance

158.2

Junction-to-board thermal resistance

33.3

°C/W

Junction-to-top characterization parameter

37.8

Junction-to-board characterization parameter

32.8

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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