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LM3209-G3 Datasheet(PDF) 1 Page - Texas Instruments

No. de pieza LM3209-G3
Descripción Electrónicos  LM3209-G3 Seamless-Transition Buck-Boost Converter for Battery-Powered 3G/4G RF Power Amplifiers
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Fabricante Electrónico  TI [Texas Instruments]
Página de inicio  http://www.ti.com
Logo TI - Texas Instruments

LM3209-G3 Datasheet(HTML) 1 Page - Texas Instruments

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2.2 PH
PVIN
EN
SGND
PGND
SW1
SW2
LM3209-G3
VOUT
FB
VCON
RF PA
VOUT: 0.6V to 4.2V
4.7 PF
10 PF
VIN: 2.7V to 5.5V
DAC
PVIN
LM3209-G3
www.ti.com
SNVS626B – NOVEMBER 2009 – REVISED MARCH 2013
LM3209-G3 Seamless-Transition Buck-Boost Converter for Battery-Powered 3G/4G RF
Power Amplifiers
Check for Samples: LM3209-G3
1
FEATURES
APPLICATIONS
2
Operates From a Single Li-Ion Cell: 2.7V to
Battery-Powered 3G/4G RF PAs
5.5V
Cellular Phones
Adjustable Output Voltage: 0.6V to 4.2V
Portable Hard Disk Drives
1A Maximum Load Capability for VIN ≥ 3.2V,
PDAs
VOUT = 3.6V
2.4 MHz (typ.) Switching Frequency
DESCRIPTION
The LM3209-G3 is buck-boost DC/DC converter
Seamless Buck-Boost Mode Transition
designed to generate output voltages above or below
Fast Output Voltage Transition: 0.8V to 4.0V in
a given input voltage. It is particularly suitable for
20 µs
single-cell Li-ion batteries for portable applications.
High-Efficiency: 95% typ. at 3.7 VIN, 3.5 VOUT, at
The LM3209-G3 operates at a 2.4 MHz typical
300 mA
switching frequency in full synchronous operation
Cycle-by-cycle Over-Current Limit
providing seamless transitions between buck and
Output Over-Voltage Clamp
boost operating modes.
Internal Compensation
The power converter topology needs only one
external inductor and two capacitors. Five internal
12-bump DSBGA Package
power switches enable high overall efficiency.
The LM3209-G3 is internally compensated for buck
and boost modes of operation, thus providing an
optimal transient response.
The LM3209-G3 is available in an 12-bump lead-free
DSBGA package of size 2.0 mm x 2.5 mm x 0.6 mm.
TYPICAL APPLICATION CIRCUIT
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Copyright © 2009–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.


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