TPS40200-HT

www.ti.com

SGLS400C – OCTOBER 2009 – REVISED DECEMBER 2012

Table 1. Bond Pad Coordinates in Microns

DISCRIPTION

PAD NUMBER

X min

Y min

X max

Y max

RC

1

63.27

1124.01

164.07

1224.81

SS

2

61.20

922.77

162.00

1023.57

COMP

3

61.20

250.38

162.00

351.18

FB

4

70.20

74.16

171.00

174.96

GND

5

1193.94

91.44

1294.74

192.24

GDRV

6

1188.90

245.34

1289.70

346.14

ISNS

7

1189.80

978.30

1290.60

1079.10

VDD

8

1137.60

1148.49

1238.40

1249.29

Table 2. Test Pad Coordinates in Microns

DISCRIPTION

PAD NUMBER

X min

Y min

X max

Y max

NC

1

189.00

27.18

256.50

94.68

NC

2

292.86

27.18

360.36

94.68

NC

3

396.72

27.18

464.22

94.68

NC

4

517.77

27.18

585.27

94.68

NC

5

757.71

27.27

825.21

94.77

PACKAGE

ORDERABLE PART NUMBER

–55°C to 175°C

D

TPS40200HD

KGD

TPS40200SKGD1

–55°C to 210°C

HKJ

TPS40200SHKJ

HKQ

TPS40200SHKQ

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

Copyright © 2009–2012, Texas Instruments Incorporated

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