TPS40210-HT

www.ti.com

SLVSAD8 – JUNE 2010

Table 1. Bond Pad Coordinates in Microns (continued)

DISCRIPTION

PAD NUMBER

X min

Y min

X max

Y max

NC (1)

962.55

1147.32

1030.05

1214.82

NC (2)

868.59

1147.32

936.09

1214.82

NC (3)

764.73

1147.32

832.23

1214.82

NC (4)

643.68

1147.32

711.18

1214.82

NC (5)

403.74

1147.23

471.24

1214.73

ORDERABLE PART NUMBER

TOP-SIDE MARKING

KGD (bare die)

TPS40210SKGD1

NA

–55°C to 210°C

HKK

TPS40210SHKK

TPS40210SHKK

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2)

Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

DEVICE RATINGS

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range unless otherwise noted

(1)

VDD

–0.3 V to 52 V

Input voltage range

RC, SS, FB, DIS/EN

–0.3 V to 10 V

ISNS

–0.3 V to 8 V

Output voltage range

COMP, BP, GDRV

–0.3 V to 9 V

Operating junction temperature range

–55°C to 210°C

Storage temperature range

–55°C to 210°C

(1)

Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

RECOMMENDED OPERATING CONDITIONS

MIN

MAX

UNIT

Input voltage

5.5

52

V

Operating junction temperature

–55

210

°C

THERMAL CHARACTERISTICS FOR HKK PACKAGE

over operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

to bottom of case

4.6

Junction-to-case thermal

°C/W

resistance

to top of case - as if formed dead bug

12.9

ELECTROSTATIC DISCHARGE (ESD) PROTECTION

TYP

UNIT

Human-Body Model (HBM)

1500

V

Charged-Device Model (CDM)

1500

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