TPS54225-Q1

SLVSAV9

– JUNE 2011

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

ORDERABLE PART NUMBER

TOP-SIDE MARKING

PowerPAD

™

–40°C to 105°C

Tape and Reel

TPS54225TPWPRQ1

54225Q1

(HTSSOP)

– PWP (14 Pins)

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2)

Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

(3)

All package options have Cu NIPDAU lead/ball finish.

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range (unless otherwise noted)

(1)

VALUE

UNIT

–0.3 to 20

V

–0.3 to 26

V

–0.3 to 6.5

V

Input voltage range

–0.3 to 6.5

V

SW1, SW2

–2 to 20

V

SW1, SW2 (10 ns transient)

–3 to 20

V

–0.3 to 6.5

V

Output voltage range

–0.3 to 0.3

V

Voltage from GND to POWERPAD

–0.2 to 0.2

V

Human Body Model (HBM)

2

kV

ESD rating Electrostatic discharge

Charged Device Model (CDM)

1

kV

Operating junction temperature

–40 to 150

°C

Storage temperature

–55 to 150

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

THERMAL INFORMATION

TPS54225-Q1

PWP

UNITS

14 PINS

Junction-to-ambient thermal resistance

55.6

Junction-to-case (top) thermal resistance

51.3

Junction-to-board thermal resistance

26.4

°C/W

Junction-to-top characterization parameter

1.8

Junction-to-board characterization parameter

20.6

Junction-to-case (bottom) thermal resistance

4.3

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

2

Copyright

© 2011, Texas Instruments Incorporated