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TPS54260-Q1 Datasheet(PDF) 4 Page - Texas Instruments |
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TPS54260-Q1 Datasheet(HTML) 4 Page - Texas Instruments |
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4 / 52 page  TPS54260-Q1 SLVSAH8F – DECEMBER 2010 – REVISED AUGUST 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating temperature range (unless otherwise noted). (1) MIN MAX UNIT VIN –0.3 65 EN(2) –0.3 5 VSENSE –0.3 3 Input voltage COMP –0.3 3 V PWRGD –0.3 6 SS/TR –0.3 3 RT/CLK –0.3 3.6 BOOT-PH –0.3 8 –0.6 65 Output voltage 200 ns –1 65 V PH 30 ns –2 65 Maximum dc voltage, T J= –40°C –0.85 Voltage difference PAD to GND ±200 mV EN 100 μA BOOT 100 mA Source current VSENSE 10 μA PH Current limit RT/CLK 100 μA VIN Current limit COMP 100 μA Sink current PWRGD 10 mA SS/TR 200 μA Operating junction temperature –40 150 °C Storage temperature, Tstg –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) See Enable and Adjusting Undervoltage Lockout (UVLO) for details. 6.2 ESD Ratings VALUE UNIT Human body model (HBM), per AEC Q100-002(1) ±2000 V(ESD) Electrostatic discharge Corner pins (1, 5, 6, 10) ±750 V Charged device model (CDM), per AEC Q100-011 Other pins ±500 (1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT TA Operating ambient temperature –40 125 °C 4 Submit Documentation Feedback Copyright © 2010–2015, Texas Instruments Incorporated Product Folder Links: TPS54260-Q1 |
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Descripción similar - TPS54260-Q1_15 |
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