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LB-SA-1000 Datasheet(PDF) 1 Page - List of Unclassifed Manufacturers |
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LB-SA-1000 Datasheet(HTML) 1 Page - List of Unclassifed Manufacturers |
1 / 2 page Liqui-Bond® SA 1000 is a thermally conductive, one-part liquid silicone adhesive with a low viscosity for easy screenability. Liqui-Bond® SA 1000 features a high thermal performance and maintains it’s structure even in severe environment applications. Liqui-Bond® SA 1000 features excellent low and high-temperature mechanical and chemical stability.The material’s mild elastic properties assist in relieving CTE stresses during thermal cycling. Liqui-Bond® SA 1000 contains no cure by-products, cures at elevated temperatures and requires refrigeration storage at 10°C.The material is available in both tube and mid-sized container forms. Note: To build a part number, visit our website at www.bergquistcompany.com. Liqui-Bond® SA 1000 (One-Part) TYPICAL APPLICATIONS INCLUDE • PCBA to housing • Discrete component to heat spreader CONFIGURATIONS AVAILABLE • With or without glass beads PDS_LB_SA 1000_March 2012 FEATURES AND BENEFITS • High thermal performance • Eliminates need for mechanical fasteners • Low viscosity for ease of screening or stenciling • Can achieve a very thin bond line • Mechanical and chemical stability • Maintains structural bond in severe-environment applications • Heat cure PRODUCT DESCRIPTION Thermally Conductive, One-Part, Liquid Silicone Adhesive March 2012 PROPERTY AS SUPPLIED IMPERIAL VALUE METRIC VALUE TEST METHOD Color Black Black Visual Viscosity (cps) (1) 125,000 125,000 ASTM D2196 Density (g/cc) 2.4 2.4 ASTM D792 Shelf Life @ 10°C (months) 6 6 — PROPERTY AS CURED - PHYSICAL Hardness (Shore A) 75 75 ASTM D2240 Continuous Use Temp (°F) / (°C) -76 to 392 -60 to 200 — Shear Strength (psi) / (MPa) 200 1.4 ASTM D1002 PROPERTY AS CURED - ELECTRICAL Dielectric Strength (V/mil) / (V/mm) 250 10,000 ASTM D149 Dielectric Constant (1000 Hz) 5.5 5.5 ASTM D150 Volume Resistivity (Ohm-meter) 1010 1010 ASTM D257 Flame Rating V-O V-O U.L.94 PROPERTY AS CURED - THERMAL Thermal Conductivity (W/m-K)1.0 1.0ASTM D5470 CURE SCHEDULE Pot Life @ 25°C (hours) (2) 10 10 — Cure @ 125°C (minutes) (3) 20 20 — Cure @ 150°C (minutes) (3) 10 10 — 1) Brookfield RV,Heli-path,Spindle TF @ 20 rpm, 25°C. 2) Based on 1/8" diameter bead. 3) Cure Schedule - time after cure temperature is achieved at the interface. Ramp time is application dependent. TYPICAL PROPERTIES OF LIQUI-BOND SA 1000 |
Número de pieza similar - LB-SA-1000 |
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Descripción similar - LB-SA-1000 |
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