TPS61020, TPS61024, TPS61025, TPS61026, TPS61027, TPS61028, TPS61029

SLVS451G – SEPTEMBER 2003 – REVISED DECEMBER 2014

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8 Specifications

8.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Input voltage on SW, VOUT, LBO, VBAT, PS, EN, FB, LBI

–0.3

7

V

Operating virtual junction temperature

–40

150

°C

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

8.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-

±750

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 500-V HBM is possible with the necessary precautions.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 250-V CDM is possible with the necessary precautions.

8.3 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

0.9

6.5

V

0.9

5.5

V

–40

125

°C

8.4 Thermal Information

TPS6102x

SON

UNIT

10 PINS

Junction-to-ambient thermal resistance

47.2

Junction-to-case (top) thermal resistance

67.5

Junction-to-board thermal resistance

21.6

°C/W

Junction-to-top characterization parameter

1.7

Junction-to-board characterization parameter

21.8

Junction-to-case (bottom) thermal resistance

3.6

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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