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TPS61026 Datasheet(PDF) 4 Page - Texas Instruments |
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TPS61026 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 31 page TPS61020, TPS61024, TPS61025, TPS61026, TPS61027, TPS61028, TPS61029 SLVS451G – SEPTEMBER 2003 – REVISED DECEMBER 2014 www.ti.com 8 Specifications 8.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Input voltage on SW, VOUT, LBO, VBAT, PS, EN, FB, LBI –0.3 7 V TJ Operating virtual junction temperature –40 150 °C Tstg Storage temperature –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 8.2 ESD Ratings VALUE UNIT Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V(ESD) Electrostatic discharge V Charged-device model (CDM), per JEDEC specification JESD22- ±750 C101(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 500-V HBM is possible with the necessary precautions. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 250-V CDM is possible with the necessary precautions. 8.3 Recommended Operating Conditions MIN NOM MAX UNIT Supply voltage at VBAT, VI (TPS61020, TPS61024, TPS61025, TPS61028) 0.9 6.5 V Supply voltage at VBAT, VI (TPS61026, TPS61029) 0.9 5.5 V Operating virtual junction temperature range, TJ –40 125 °C 8.4 Thermal Information TPS6102x THERMAL METRIC(1) SON UNIT 10 PINS RθJA Junction-to-ambient thermal resistance 47.2 RθJC(top) Junction-to-case (top) thermal resistance 67.5 RθJB Junction-to-board thermal resistance 21.6 °C/W ψJT Junction-to-top characterization parameter 1.7 ψJB Junction-to-board characterization parameter 21.8 RθJC(bot) Junction-to-case (bottom) thermal resistance 3.6 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2003–2014, Texas Instruments Incorporated Product Folder Links: TPS61020 TPS61024 TPS61025 TPS61026 TPS61027 TPS61028 TPS61029 |
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