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TPS65400RGZT Datasheet(PDF) 5 Page - Texas Instruments |
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TPS65400RGZT Datasheet(HTML) 5 Page - Texas Instruments |
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5 / 76 page  TPS65400 www.ti.com SLVSCQ9B – NOVEMBER 2014 – REVISED SEPTEMBER 2015 Pin Functions (continued) PIN DESCRIPTION NAME NO. Open-drain output that is pulled low for 200 µs when a timeout condition is detected by the I2C watchdog on I2CALERT 41 either SDA or SCL. SDA 42 Data input/output pin for I2C bus SCL 43 Clock input pin for I2C bus CLK_OUT 44 Clock output signal. Open-collector output, requires pull up. Soft-start for SW1 (default). A capacitor is used to set the startup time. This pin can also be reconfigured SS1/PG1 45 through I2C to display the PGOOD1 signal instead. COMP1 46 Compensation pin for external compensation network for SW1 VFB1 47 Feedback input pin for SW1 ENSW1/ENSEQ 48 Enable input pin for SW1. Active high. 2-µA internal pullup current is inside. 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature (unless otherwise noted) (1) MIN MAX UNIT PVIN1, PVIN2, PVIN3, PVIN4, VIN –0.3 20 CB1, CB2, CB3, CB4 referenced to SWx –0.3 7.5 ENSW1, ENSW2, ENSW3, ENSW4, SCL, SDA, CLK_OUT, VFB1, VFB2, VFB3, VFB4, –0.3 VDDD or 3.6 RST_N, SCL, SDA, I2CALERT, CLK_OUT, I2CADDR, RCLOCK_SYNC Input SW1, SW2, SW3, SW4 –1 20 V voltage VDDA, VDDG –0.3 7.5 PGOOD, SS1/PG1, SS2/PG2, SS3/PG3, SS4/PG4, COMP1, COMP2, COMP3, COMP4, –0.3 VDDA or 7.5 CE VDDD –0.3 3.6 TJ(max) Junction temperature 150 °C Maximum lead temperature (soldering, 10 s) 260 °C Tstg Storage temperature –55 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 Electrostatic V(ESD) V discharge Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±750 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VIN1, VIN2, VIN3, VIN4 Input voltage range 4.5 18 V IOUT1, IOUT2 Load current 0 4 A IOUT3, IOUT4 Load current 0 2 A VFB1, VFB2, VFB3, VFB4 Voltage feedback 0.6 1.87 V TJ Junction temperature range –40 125 °C Copyright © 2014–2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: TPS65400 |
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