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SG117A Datasheet(PDF) 2 Page - Microsemi Corporation |
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SG117A Datasheet(HTML) 2 Page - Microsemi Corporation |
2 / 8 page SG117A/SG117 SERIES 2/93 Rev 1.1 2/94 LINFINITY Microelectronics Inc. Copyright © 1994 11861 Western Avenue ∞ ∞ ∞ ∞ ∞ Garden Grove, CA 92841 2 (714) 898-8121 ∞ ∞ ∞ ∞ ∞ FAX: (714) 893-2570 ELECTRICAL CHARACTERISTICS (Unless otherwise specified, these specifications apply over full operating ambient temperatures for SG117A/SG117 with -55°C ≤ T A ≤ 125°C, SG217A/ SG217 with -25°C ≤ T A ≤ 150°C, SG 317A/SG317 with 0°C ≤ TA ≤ 125°C, VIN - VOUT = 5.0V , and for IOUT = 500mA (K, R, and IG), and I OUT = 100mA (T and L packages). Although power dissipation is internally limited, these specifications are applicable for power dissipations of 2W for the T and L packages, and 20W for the K, R, and IG packages. I MAX is 1.5A for the K, R, and IG packages and 500mA for the T and L packages. Low duty cycle pulse testing techniques are used which maintains junction and case temperatures equal to the ambient temperature.) Power Dissipation ........................................ Input to Output Voltage Differential ................................. Storage Temperature Range .......................... ABSOLUTE MAXIMUM RATINGS (Note 1) Internally Limited 40V -65 °C to 150°C Operating Junction Temperature Hermetic (K, R, T, L, IG-Packages) ............................ Lead Temperature (Soldering, 10 Seconds) .............. 150 °C 300 °C Note 1. Exceeding these ratings could cause damage to the device. Input Voltage Range .............................. (V OUT + 3.5V) to 37V Operating Junction Temperature Range SG117A/SG117 ......................................... SG217A/SG217 ......................................... SG317A/SG317 ............................................ -55°C to 150°C -25°C to 150°C 0°C to 125°C Note 2. Range over which the device is functional. Note 3. These ratings are applicable for junction temperatures of less than 150°C. RECOMMENDED OPERATING CONDITIONS (Note 2 & 3) Units SG117/SG217 Min. Typ. Max. Min. Typ. Max. SG117A/SG217A Parameter Test Conditions I OUT = 10mA T A = 25°C 3V ≤ (V IN - VOUT) ≤ 40V, P ≤ PMAX, 10mA ≤ I OUT ≤ IMAX 3V ≤ (V IN - VOUT) ≤ 40V, I L = 10mA T A = 25°C T A = TMIN to T MAX 10mA ≤ I OUT ≤ IMAX V OUT ≤ 5V, TA = 25°C V OUT ≥ 5V, TA = 25°C V OUT ≤ 5V V OUT ≥ 5V T A = 25°C, 20ms pulse V OUT = 10V, f =120Hz C ADJ = 1µF, TA = 25°C C ADJ = 10µF 10mA ≤ I OUT ≤ IMAX , 2.5V ≤ (VIN - VOUT) ≤ 40V 1.238 1.225 66 1.250 1.250 0.005 0.01 5 0.1 20 0.3 0.002 65 80 50 0.2 1.262 1.270 0.01 0.02 15 0.3 50 1 0.02 100 5 1.20 66 1.25 0.01 0.02 5 0.1 20 0.3 0.03 65 80 50 0.2 1.30 0.02 0.05 15 0.3 50 1 0.07 100 5 V V %/V %/V mV % mV % %/W dB dB µA µA K Package: Thermal Resistance-Junction to Case, θ JC ................. 3.0°C/W Thermal Resistance-Junction to Ambient, θ JA .............. 35°C/W R Package: Thermal Resistance-Junction to Case, θ JC ................. 5.0°C/W Thermal Resistance-Junction to Ambient, θ JA ............. 40°C/W T Package: Thermal Resistance-Junction to Case, θ JC .................. 15°C/W Thermal Resistance-Junction to Ambient, θ JA ........... 120°C/W IG Package: Thermal Resistance-Junction to Case, θ JC ................. 3.5°C/W Thermal Resistance-Junction to Ambient, θ JA ............. 42°C/W L Package: Thermal Resistance-Junction to Case, θ JC .................. 35°C/W Thermal Resistance-Junction to Ambient, θ JA ........... 120°C/W THERMAL DATA Note A. Junction Temperature Calculation: T J = T A + (P D x θ JA ). Note B. The above numbers for θ JC are maximums for the limiting thermal resistance of the package in a standard mount- ing configuration. The θ JA numbers are meant to be guidelines for the thermal performance of the device/pc- board system. All of the above assume no ambient airflow. Reference Voltage Line Regulation (Note 4) Load Regulation (Note 4) Thermal Regulation (Note 5) Ripple Rejection Adjust Pin Current Adjust Pin Current Change |
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