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LM95233CISD Datasheet(PDF) 4 Page - Texas Instruments |
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LM95233CISD Datasheet(HTML) 4 Page - Texas Instruments |
4 / 44 page 11 12 13 14 SMBus Master * Note, place close to LM95233 pins. ** Note, optional - place close to LM95233 pins. LM95233 1 2 3 4 NC VDD NC NC SMBCLK C1* 100 pF C2 0.1 PF SMBCLK SMBDAT C5** 100 pF +3.3V Standby R4 1.3k R5 1.3k D- D2+ D1+ 5 6 7 8 9 10 A0 SMBDAT PROCESSOR Q1 MMBT3904 C4** 100 pF R3 10k R2 10k R1 10k SO DIMM C3 10 PF TCRIT2 TCRIT1 TCRIT3 GND LM95233 SNIS145E – AUGUST 2006 – REVISED MARCH 2013 www.ti.com Typical Application These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) Supply Voltage −0.3V to 6.0V Voltage at SMBDAT, SMBCLK, TCRIT1, TCRIT2, TCRIT3 −0.5V to 6.0V Voltage at Other Pins −0.3V to (VDD + 0.3V) D − Input Current ±1 mA Input Current at All Other Pins (2) ±5 mA Package Input Current (2) 30 mA SMBDAT, TCRIT1, TCRIT2, TCRIT3 Output Sink Current 10 mA Storage Temperature −65°C to +150°C ESD Susceptibility (3) Human Body Model 2000V Machine Model 200V Charge Device Model 1000V Soldering process must comply with Texas Instruments' reflow temperature profile specifications. Refer to SNOA549 (4) (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not apply when operating the device beyond its rated operating conditions. (2) When the input voltage (VI) at any pin exceeds the power supplies (VI < GND or VI > VDD), the current at that pin should be limited to 5 mA. Parasitic components and or ESD protection circuitry are shown in the table below for the LM95233's pins. (3) Human body model, 100 pF discharged through a 1.5 k Ω resistor. Machine model, 200 pF discharged directly into each pin. Charged Device Model (CDM) simulates a pin slowly acquiring charge (such as from a device sliding down the feeder in an automated assembler) then rapidly being discharged. (4) Reflow temperature profiles are different for packages containing lead (Pb) than for those that do not. 4 Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: LM95233 |
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