PAGE . 1

GS1JF-AU / GS1MF-AU

May 8,2014

Document Number : 131107

FEATURES

• For surface mounted applications in order to optimize board space

• Easy pick and place

• Plastic package has Underwriters Laboratory Flammability

Classification 94V-O

• Low Forward Drop

• High temperature soldering : 260

• Glass Passivated Chip Junction

• Ultra Thin Profile Package for Space Constrained Utilization

• Package suitable for automated handling

• Acqire quality system certificate : TS16949

• AEC-Q101 qualified

• Lead free in compliance with EU RoHS 2011/65/EU directive

• Green molding compound as per IEC61249 Std. . (Halogen Free)

MECHANICAL DATA

• Case: SMAF molded plastic

• Terminals: Solder plated, solderable per MIL-STD-750, Method 2026

• Polarity: Color band denotes cathode end

• Approx weight: 0.001 ounces, 0.0328 grams

• Marking: Part number

SURFACE MOUNT RECTIFIER

NOTES : 1. Mounted on 48cm

2

FR-4 PCB.

VOLTAGE

600-1000 Volt

1 Ampere

CURRENT

1

2

Cathode

Anode

PA RA M E TE R

S YM B O L

G S 1 J F - A U

GS 1 M F - A U

UNITS

Re c ur r ent P eak Re ve r s e Vo lt age

V

RR M

600

1000

V

RM S Vo lt age

V

RM S

420

700

V

D C B loc k i ng Vo lt age

V

R

600

1000

V

A ver age F o r war d C ur r ent

I

F( AV )

1A

P eak F o r war d S ur ge C ur r ent : 8.3m s s i ng le ha lf s i ne - wave

s uper i m posed on r a t ed load

I

FS M

30

A

For war d Vo lt age at 1A

V

F

1. 1

V

D C Re ve r s e C ur r ent at Ra te d

D C B loc k i ng Vo lt age

T

R

1

A

Typi c a l J unc t i on C apac i tance

C

J

7p F

Typi c a l Ther m a l Re s i s tanc e , J unc ti o n to Lead ( Note 1)

J unc t i o n t o A m b i e nt ( No t e 1 )

JL

JA

20

83

Oper ati ng J unc t i on Te m per atur e and S t or age Te m p e r atur e Ra ng e

T

- 55 t o + 150