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LMV7219M5 Datasheet(PDF) 4 Page - Texas Instruments

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No. de pieza LMV7219M5
Descripción Electrónicos  Comparator with Rail-to-Rail Output
Download  25 Pages
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Fabricante Electrónico  TI1 [Texas Instruments]
Página de inicio  http://www.ti.com
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LMV7219M5 Datasheet(HTML) 4 Page - Texas Instruments

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LMV7219
SNOS458G – APRIL 2000 – REVISED JANUARY 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1) (2)
MIN
MAX
UNIT
Differential input voltage
± Supply Voltage
Output short circuit duration
See(3)
Supply voltage (V+ - V)
5.5
V
Infrared or Convection (20 sec)
235
°C
Soldering information
Wave Soldering (10 sec)
260 (lead temp)
°C
(V+) + 0.4
Voltage at input/output pins
V
(V)
− 0.4
Current at input pin(4)
±10
mA
Maximum junction temperature
150
°C
Storage temperature
−65
150
°C
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical characteristics.
(2)
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3)
Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C. Output currents in excess of ±30mA over long term may adversely
affect reliability.
(4)
Limiting input pin current is only necessary for input voltages that exceed absolute maximum input voltage ratings.
6.2 ESD Ratings
VALUE
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V(ESD)
Electrostatic discharge
V
Charged-device model (CDM), per JEDEC specification JESD22-
±150
C101(2)
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 500-V HBM is possible with the necessary precautions. Pins listed as ±2000 V may actually have higher performance.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 250-V CDM is possible with the necessary precautions. Pins listed as ±150 V may actually have higher performance.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
Supply voltages (V+ - V)
2.7
5
V
Operating Temperature Range(1)
−40
+85
°C
(1)
The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(MAX) - TA)/RθJA. All numbers apply for packages soldered directly into a PC board.
6.4 Thermal Information
DCK
DBV
THERMAL METRIC(1)
UNIT
5 PINS
5 PINS
RθJA
Junction-to-ambient thermal resistance
478
265
°C/W
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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Product Folder Links: LMV7219


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