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TPA3250D2 Datasheet(PDF) 6 Page - Texas Instruments

No. de pieza TPA3250D2
Descripción Electrónicos  70-W Stereo, 130-W peak PurePath Ultra-HD Pad Down Class-D Amplifier
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Fabricante Electrónico  TI1 [Texas Instruments]
Página de inicio  http://www.ti.com
Logo TI1 - Texas Instruments

TPA3250D2 Datasheet(HTML) 6 Page - Texas Instruments

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TPA3250D2
SLASE99 – DECEMBER 2015
www.ti.com
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
TYP
MAX
UNIT
PVDD_x
Half-bridge supply
DC supply voltage
12
32
38
V
Supply for logic regulators and gate-drive
GVDD_x
DC supply voltage
10.8
12
13.2
V
circuitry
VDD
Digital regulator supply voltage
DC supply voltage
10.8
12
13.2
V
RL(BTL)
2.7
4
Output filter inductance within
RL(SE)
Load impedance
1.5
3
recommended value range
RL(PBTL)
1.6
2
LOUT(BTL)
5
LOUT(SE)
Output filter inductance
Minimum output inductance at IOC
5
μH
LOUT(PBTL)
5
Nominal
430
450
470
PWM frame rate selectable for AM
FPWM
interference avoidance; 1% Resistor
AM1
475
500
525
kHz
tolerance
AM2
575
600
625
Nominal; Master mode
29.7
30
30.3
R(FREQ_ADJ)
PWM frame rate programming resistor
AM1; Master mode
19.8
20
20.2
k
AM2; Master mode
9.9
10
10.1
CPVDD
PVDD close decoupling capacitors
1.0
μF
ROC
Over-current programming resistor
Resistor tolerance = 5%
22
30
k
ROC(LATCHED)
Over-current programming resistor
Resistor tolerance = 5%
47
64
k
Voltage on FREQ_ADJ pin for slave
V(FREQ_ADJ)
Slave mode
3.3
V
mode operation
TJ
Junction temperature
0
125
°C
7.4 Thermal Information
TPA3250D2
THERMAL METRIC(1)
DDV 44-PINS HTSSOP
UNIT
JEDEC STANDARD 4 LAYER PCB
RθJA
Junction-to-ambient thermal resistance
26.0
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
10.2
°C/W
RθJB
Junction-to-board thermal resistance
6.5
°C/W
ψJT
Junction-to-top characterization parameter
0.2
°C/W
ψJB
Junction-to-board characterization parameter
6.5
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
1.4
°C/W
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
6
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