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TPA6130A2RTJT Datasheet(PDF) 28 Page - Texas Instruments

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No. de pieza TPA6130A2RTJT
Descripción Electrónicos  Stereo Headphone Amplifier
Download  39 Pages
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Fabricante Electrónico  TI1 [Texas Instruments]
Página de inicio  http://www.ti.com
Logo TI1 - Texas Instruments

TPA6130A2RTJT Datasheet(HTML) 28 Page - Texas Instruments

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background image
A1
1uf
VDD
Top Layer Ground Pour
Top Layer Signal Traces
Via to bottom Ground Plane
It is recommended to place a top layer ground pour for
shielding around TPA6130A2 and connect to lower main
PCB ground plane by multiple vias
Pad to top Layer Ground Pour
TPA6130A2
A2
A3
A4
B1
B4
C1
C2
C4
D1
D2
D3
D4
VDD
1uf
1uf
0.47uf
0.47uf
0.47uf
Lower Layer Signal Traces
Via Between Signal Layers
0.47uf
Audio
Source
1uf
HPLEFT
HPRIGHT
Place decoupling caps as close to
TPA6120A2 pins as possible
Keep vias to ground plane away
from top layer ground pads to
distribute inductances
B2
C3
B3
Top layer pad with via to lower
signal layer for lead out
Minimize charge pump cap series resistance.
Keep close to pins with zero vias.
TPA6130A2
SLOS488F – NOVEMBER 2006 – REVISED MARCH 2015
www.ti.com
11.2 Layout Example
Figure 48. YZH (DSBGA) Package
28
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Product Folder Links: TPA6130A2


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