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TPA6130A2RTJT Datasheet(PDF) 28 Page - Texas Instruments |
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TPA6130A2RTJT Datasheet(HTML) 28 Page - Texas Instruments |
28 / 39 page A1 1uf VDD Top Layer Ground Pour Top Layer Signal Traces Via to bottom Ground Plane It is recommended to place a top layer ground pour for shielding around TPA6130A2 and connect to lower main PCB ground plane by multiple vias Pad to top Layer Ground Pour TPA6130A2 A2 A3 A4 B1 B4 C1 C2 C4 D1 D2 D3 D4 VDD 1uf 1uf 0.47uf 0.47uf 0.47uf Lower Layer Signal Traces Via Between Signal Layers 0.47uf Audio Source 1uf HPLEFT HPRIGHT Place decoupling caps as close to TPA6120A2 pins as possible Keep vias to ground plane away from top layer ground pads to distribute inductances B2 C3 B3 Top layer pad with via to lower signal layer for lead out Minimize charge pump cap series resistance. Keep close to pins with zero vias. TPA6130A2 SLOS488F – NOVEMBER 2006 – REVISED MARCH 2015 www.ti.com 11.2 Layout Example Figure 48. YZH (DSBGA) Package 28 Submit Documentation Feedback Copyright © 2006–2015, Texas Instruments Incorporated Product Folder Links: TPA6130A2 |
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