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SI8040AA-B-IU Datasheet(PDF) 7 Page - Silicon Laboratories |
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SI8040AA-B-IU Datasheet(HTML) 7 Page - Silicon Laboratories |
7 / 23 page Si80xx Rev. 1.0 7 Table 3. Thermal Characteristics Parameter Symbol QSOP-16 Unit IC Junction-to-Air Thermal Resistance JA 105 ºC/W Table 4. Absolute Maximum Ratings1 Parameter Symbol Min Typ Max Unit Storage Temperature2 TSTG –65 — 150 ºC Ambient Temperature Under Bias TA –40 — 125 ºC Junction Temperature TJ —— 150 °C Supply Voltage VDD1, VDD2 –0.5 — 7.0 V Input Voltage VI –0.5 — VDD + 0.5 V Output Voltage VO –0.5 — VDD + 0.5 V Output Current Drive Channel IO —— 22 mA Latchup Immunity3 —— 100 V/ns Lead Solder Temperature (10 s) — — 260 ºC Maximum Isolation (Input to Output) (1 sec) QSOP-16 — — 1500 VRMS Notes: 1. Permanent device damage may occur if the absolute maximum ratings are exceeded. Functional operation should be restricted to conditions as specified in the operational sections of this data sheet. 2. VDE certifies storage temperature from –40 to 150 °C. 3. Latchup immunity specification is for slew rate applied across GND1 and GND2. |
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