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AMC1204DW Datasheet(PDF) 5 Page - Texas Instruments |
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AMC1204DW Datasheet(HTML) 5 Page - Texas Instruments |
5 / 37 page AMC1204, AMC1204B www.ti.com SBAS512E – APRIL 2011 – REVISED SEPTEMBER 2015 6 Specifications 6.1 Absolute Maximum Ratings Over the operating ambient temperature range, unless otherwise noted. (1) MIN MAX UNIT Supply voltage, AVDD to AGND or DVDD to DGND –0.3 6 V Analog input voltage at VINP, VINN AGND – 0.5 AVDD + 0.5 V Digital input voltage at CLKIN DGND – 0.3 DVDD + 0.3 V Input current to any pin except supply pins –10 10 mA Maximum virtual junction temperature, TJ 150 °C Operating ambient temperature, TOA –40 125 °C Storage temperature, Tstg –65 150 °C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under the Electrical Characteristics is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability. 6.2 ESD Ratings VALUE UNIT Human-body model (HBM), per JEDEC standard 22, test method A114- ±3000 C.01(1) V(ESD) Electrostatic discharge Charged-device model (CDM), per JEDEC standard 22, test method V ±1500 C101(2) Machine model (MM), per JEDEC standard 22, test method A115A ±200 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT TA Operating ambient temperature –40 105 °C AVDD High-side (analog) supply voltage 4.5 5 5.5 V DVDD Controller-side (digital) supply voltage 2.7 3.3 5.5 V 6.4 Thermal Information AMC1204, AMC1204B THERMAL METRIC(1) DW (SOIC) DWV (SOIC) UNIT 16 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 78.5 106.5 °C/W RθJC(top) Junction-to-case (top) thermal resistance 41.3 53.6 °C/W RθJB Junction-to-board thermal resistance 50.2 60.3 °C/W ψJT Junction-to-top characterization parameter 11.5 18.5 °C/W ψJB Junction-to-board characterization parameter 41.2 58.9 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: AMC1204 AMC1204B |
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