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HYS64V16300GU Datasheet(PDF) 1 Page - Infineon Technologies AG

No. de pieza HYS64V16300GU
Descripción Electrónicos  3.3 V 16M x 64/72-Bit 1 Bank 128MByte SDRAM Module 3.3 V 32M x 64/72-Bit 2 Bank 256MByte SDRAM Module 168-Pin Unbuffered DIMM Modules
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Fabricante Electrónico  INFINEON [Infineon Technologies AG]
Página de inicio  http://www.infineon.com
Logo INFINEON - Infineon Technologies AG

HYS64V16300GU Datasheet(HTML) 1 Page - Infineon Technologies AG

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INFINEON Technologies
1
9.01
HYS 64/72V16300/32220GU
SDRAM-Modules
3.3 V 16M x 64/72-Bit 1 Bank 128MByte SDRAM Module
3.3 V 32M x 64/72-Bit 2 Bank 256MByte SDRAM Module
168-Pin Unbuffered DIMM Modules
Description
The HYS 64(72)V16300GU and HYS 64(72)V32220GU are industry-standard 168-pin 8-byte Dual
In-line Memory Modules (DIMMs) which are organized as 16M
× 64, 16M × 72 in 1 bank and
32M
× 64 and 32M × 72 in two banks of high-speed memory arrays designed with 128Mbit
Synchronous DRAMs (SDRAMs) for non-parity and ECC applications. The DIMMs use -7 speed
sorted 16M
× 8 SDRAM devices in TSOP54 packages to meet the PC133-222 requirements, -7.5
speed sorted for PC133-333 and use -8 components for the standard PC100-222 applications.
Decoupling capacitors are mounted on the PC board. The PC board design is in accordance with
INTEL’s Module Specification. The DIMMs have Serial Presence Detect, implemented with a serial
E
2PROM using the two-pin I2C protocol. The first 128 bytes are utilized by the DIMM manufacturer
and the second 128 bytes are available to the end user. All INFINEON 168-pin DIMMs provide a
high performance, flexible 8-byte interface in a 133.35 mm long footprint, with 1.25“ (31.75 mm)
height.
• 168-Pin unbuffered 8-Byte Dual-In-Line
SDRAM Modules for PC main memory
applications
• PC100-222, PC133-333 and PC133-222
versions
• 1 bank 16M
× 64, 16M × 72 and 2 bank
32M
× 64, 32M × 72 organzation
• Optimized for byte-write non-parity (x64) or
ECC (x72) applications
• JEDEC standard Synchronous DRAMs
(SDRAM)
• Fully PC board layout compatible to INTEL’s
Rev. 1.0 Module Specification
• SDRAM Performance:
• Programmed Latencies:
• Single +3.3 V(
±0.3 V) Power Supply
• Programmable CAS Latency, Burst Length,
and Wrap Sequence
(Sequential and Interleave)
• Auto-Refresh (CBR) and Self-Refresh
• Decoupling capacitors mounted on substrate
• All inputs and outputs are LVTTL compatible
• Serial Presence Detect with E
2PROM
• Utilizes 16M
× 8 SDRAMs in TSOPII-54
packages with 4096 refresh cycles every
64 ms
•133.35 mm
× 31.75 mm × 4,00 mm card size
with gold-contact pads
(JEDEC MO-161-BA)
-7 /-7.5
-8
Unit
PC133
PC100
fCK Max. Clock
Frequency
133
100
MHz
tAC Clock Access
Time
5.4
6
ns
Product Speed
CL
tRCD
tRP
-7
PC133-222
2
2
2
-7.5
PC133-333
3
3
3
-8
PC100-222
2
2
2


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