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74F163ASC Datasheet(PDF) 7 Page - National Semiconductor (TI) |
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74F163ASC Datasheet(HTML) 7 Page - National Semiconductor (TI) |
7 / 10 page Ordering Information The device number is used to form part of a simplified purchasing code where the package type and temperature range are defined as follows 74F 161A163A S C X Temperature Range Family Special Variations 74FeCommercial QR e Commercial grade device 54FeMilitary with burn-in QB e Military grade device with Device Type environmental and burn-in processing Package Code X e Devices shipped in 13 reel P e Plastic DIP D e Ceramic DIP Temperature Range F e Flatpak CeCommercial (0 Cto a70 C) L e Leadless Chip Carrier (LCC) MeMilitary (b55 Cto a125 C) S e Small Outline Package SOIC JEDEC SJ e Small Outline Package SOIC EIAJ Physical Dimensions inches (millimeters) 20-Lead Ceramic Leadless Chip Carrier (L) NS Package Number E20A 7 |
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