SN54HC74, SN74HC74

www.ti.com

SCLS094E – DECEMBER 1982 – REVISED DECEMBER 2015

6.4 Thermal Information

SN74HC74

SN54HC74

D

DB

N

NS

PW

J

W

FK

UNIT

(SOIC)

(SSOP) (PDIP)

(SO)

(TSSOP) (CDIP)

(CFP)

(LCCC)

14 PINS

14 PINS

20 PINS

Junction-to-ambient thermal resistance

86

96

80

76

113

—

—

—

°C/W

Junction-to-case (top) thermal resistance

—

—

—

—

—

15.05

14.65

5.61

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.5 Electrical Characteristics

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

2 V

1.9

1.998

4.5 V

4.4

4.499

6 V

5.9

5.999

3.98

4.3

SN54HC74

4.5 V

3.7

V

SN74HC74

3.84

5.48

5.8

SN54HC74

6 V

5.2

SN74HC74

5.34

2 V

0.002

0.1

4.5 V

0.001

0.1

6 V

0.001

0.1

0.17

0.26

SN54HC74

4.5 V

0.4

V

SN74HC74

0.33

0.15

0.26

SN54HC74

6 V

0.4

SN74HC74

0.33

±0.1

±100

6 V

nA

SN54HC74,

±1000

SN74HC74

4

SN54HC74

6 V

80

µA

SN74HC74

40

2 V to 6 V

3

10

pF

No load

2 V to 6 V

35

pF

Copyright © 1982–2015, Texas Instruments Incorporated

Submit Documentation Feedback

5

Product Folder Links: SN54HC74 SN74HC74