SN54HC245, SN74HC245

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SCLS131E – DECEMBER 1982 – REVISED SEPTEMBER 2015

6.4 Thermal Information

SNx4HC245

DB

DW

N

NS

PW

UNIT

(SSOP)

(SOIC)

(PDIP)

(SOP)

(TSSOP)

20 PINS

Junction-to-ambient thermal resistance

92.1

77.0

57.0

74.1

99.7

°C/W

Junction-to-case (top) thermal resistance

53.9

41.5

48.6

40.6

34.0

°C/W

Junction-to-board thermal resistance

47.2

44.8

38.0

41.6

50.7

°C/W

Junction-to-top characterization parameter

16.5

16.8

25.4

14.8

1.8

°C/W

Junction-to-board characterization parameter

46.8

44.3

37.8

41.2

50.1

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.5 Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)

SN54HC245

SN74HC245

PARAMETER

TEST CONDITIONS

UNIT

MIN

TYP

MAX

MIN

MAX

MIN

MAX

2 V

1.9

1.998

1.9

1.9

4.5 V

4.4

4.499

4.4

4.4

6 V

5.9

5.999

5.9

5.9

V

4.5 V

3.98

4.3

3.7

3.84

6 V

5.48

5.8

5.2

5.34

2 V

0.002

0.1

0.1

0.1

4.5 V

0.001

0.1

0.1

0.1

6 V

0.001

0.1

0.1

0.1

V

4.5 V

0.17

0.26

0.4

0.33

6 V

0.15

0.26

0.4

0.33

DIR or OE

6 V

±0.1

±100

±1000

±1000

nA

A or B

6 V

±0.01

±0.5

±10

±5

µA

6 V

8

160

80

µA

DIR or OE

2 V to 6 V

3

10

10

10

pF

over recommended operating free-air temperature range (unless otherwise noted)

(see Figure 3)

SN54HC245

SN74HC245

FROM

TO

PARAMETER

UNIT

(INPUT)

(OUTPUT)

MIN

TYP

MAX

MIN

MAX

MIN

MAX

2 V

40

105

160

130

A or B

B or A

4.5 V

15

21

32

26

ns

6 V

12

18

27

22

2 V

125

230

340

290

OE

A or B

4.5 V

23

46

68

58

ns

6 V

20

39

58

49

2 V

74

200

300

250

OE

A or B

4.5 V

25

40

60

50

ns

6 V

21

34

51

43

2 V

20

60

90

75

A or B

4.5 V

8

12

18

15

ns

6 V

6

10

15

13

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