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TPS3808G25DBVTG4 Datasheet(PDF) 5 Page - Texas Instruments

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No. de pieza TPS3808G25DBVTG4
Descripción Electrónicos  Low-Quiescent-Current, Programmable-Delay Supervisory Circuit
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Fabricante Electrónico  TI1 [Texas Instruments]
Página de inicio  http://www.ti.com
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TPS3808G25DBVTG4 Datasheet(HTML) 5 Page - Texas Instruments

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TPS3808
www.ti.com
SBVS050K – MAY 2004 – REVISED OCTOBER 2015
7 Specifications
7.1 Absolute Maximum Ratings
over operating junction temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
VDD
–0.3
7
V
Voltage
VCT
–0.3
VDD + 0.3
V
VRESET, VMR, VSENSE
–0.3
7
V
Current
RESET pin
–5
5
mA
Operating junction, TJ
(2)
–40
150
°C
Temperature
Storage, Tstg
–65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
As a result of the low dissipated power in this device, it is assumed that TJ = TA.
7.2 ESD Ratings
VALUE
UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001,
±2000
all pins(1)
V(ESD)
Electrostatic discharge
V
Charged device model (CDM), per JEDEC specification
±500
JESD22-C101, all pins(2)
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
VDD
Input supply range
1.7
6.5
V
VSENSE
SENSE pin voltage
0
6.5
V
V(Ct)
CT pin voltage
VDD
V
VMR
MR pin voltage
0
6.5
V
VRESET
RESET pin voltage
0
6.5
V
IRESET
RESET pin current
0.0003
5
mA
7.4 Thermal Information
TPS3808
THERMAL METRIC(1)
DBV (SOT-23)
DRV (WSON)
UNIT
6 PINS
6 PINS
RθJA
Junction-to-ambient thermal resistance
180.9
178.1
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
117.8
95.6
°C/W
RθJB
Junction-to-board thermal resistance
27.8
135
°C/W
ψJT
Junction-to-top characterization parameter
1.12
6.3
°C/W
ψJB
Junction-to-board characterization parameter
27.3
136.6
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
7.3
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
Copyright © 2004–2015, Texas Instruments Incorporated
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