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GX3190 Datasheet(PDF) 45 Page - Semtech Corporation |
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GX3190 Datasheet(HTML) 45 Page - Semtech Corporation |
45 / 47 page GX3190 146 x 290 3.5Gb/s Crosspoint Final Data Sheet Rev. 2 GENDOC-056076 March 2013 45 of 47 Proprietary & Confidential www.semtech.com 6.2 Package Thermal Data and Information 6.3 Marking Diagram Figure 6-2: Marking Diagram Table 6-1: Package Thermal Data and Information Parameter Value Package Type 50mm x 50mm HFC BGA Moisture Sensitivity Level 3 Junction to Case Thermal Resistance, θj-c 0.31°C/W Junction to Air Thermal Resistance, θj-a (at zero airflow) N/A. This device requires a heat sink. See Semtech’s Crosspoint Design Guide. Junction to Board Thermal Resistance, θj-b 2.1°C/W Pb-free and RoHS Compliant Yes Instructions: GX3190 Package Mark ZZZZZZ Marking batch work order information E3 Pb-free & Green indicator YYWW Date Code Pin 1 Indicator GX3190 ZZZZZZE3 XXXXXX-YYWW XXXXXX Assembly batch work order information |
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