TPS61259YFFT datasheet(5/35 Pages) TI1

No. de pieza	TPS61259YFFT

Descripción Electrónicos	High Efficiency Step-Up Converter In Chip Scale Packaging

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Fabricante Electrónico	TI1 [Texas Instruments]

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TPS61253, TPS61254, TPS61256, TPS61258, TPS61259, TPS612592

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SLVSAG8F – SEPTEMBER 2011 – REVISED MARCH 2016

Product Folder Links: TPS61253 TPS61254 TPS61256 TPS61258 TPS61259 TPS612592

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For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).

7.4 Thermal Information

THERMAL METRIC(1)

TPS6125x

UNIT

YFF

9 PINS

RθJA

Junction-to-ambient thermal resistance

108.3

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

1.0

RθJB

Junction-to-board thermal resistance

18

ψJT

Junction-to-top characterization parameter

4.2

ψJB

Junction-to-board characterization parameter

17.9

7.5 Electrical Characteristics

Minimum and maximum values are at VIN = 2.3V to 5.5V, EN = 1.8V, TA = –40°C to 85°C; Circuit of Parameter Measurement

Information section (unless otherwise noted). Typical values are at VIN = 3.6V, EN = 1.8V, TA = 25°C (unless otherwise

noted).

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

SUPPLY CURRENT

IQ

Operating quiescent current

into VIN Operating quiescent current

into VOUT Standby mode quiescent current

into VIN Standby mode quiescent current

into VOUT

IOUT = 0mA, VIN = 3.6V

EN = VIN, BP = GND

Device not switching

30

45

µA

7

15

µA

IOUT = 0mA, VIN = VOUT = 3.6V

EN = GND, BP = VIN

Device not switching

11

20

µA

9.5

15

µA

ISD

Shutdown current

EN = GND, BP = GND

0.85

5.0

μA

VUVLO

Under-voltage lockout threshold

Falling

2.0

2.1

V

Hysteresis

0.1

V

ENABLE, BYPASS

VIL

Low-level input voltage

0.4

V

VIH

High-level input voltage

1.0

V

Ilkg

Input leakage current

Input connected to GND or VIN

0.5

µA

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TPS61259YFFT Datasheet(PDF) 5 Page - Texas Instruments

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