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TPS62510DRCRG4 Datasheet(PDF) 4 Page - Texas Instruments |
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TPS62510DRCRG4 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 28 page TPS62510 SLVS651B – MAY 2006 – REVISED DECEMBER 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings Over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VS Supply voltage at PVIN, AVIN –0.3 4 V Voltage at EN, MODE, OVT, FB, PG(2) –0.3 4 V Voltage at SW(2) –0.3 VIN + 0.3 V TJ Operating junction temperature –40 150 °C Tstg Storage temperature –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to network ground terminal. 6.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 V(ESD) Electrostatic discharge V Charged device model (CDM), per JEDEC specification JESD22-C101, all ±1000 pins(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions Over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VIN Input voltage on pins PVIN and AVIN 1.8 3.8 V VOUT Output voltage 0.6 VIN V IOUT Output current, VIN = 1.8 V to 3.6 V 1500 mA L Inductor value 2.2 μH CIN Input capacitor value(1) 10 μF COUT Output capacitance value(1) 22 μF TA Operating ambient temperature -40 85 °C TJ Operating junction temperature –40 125 °C (1) See Application and Implementation for more information. 6.4 Thermal Information TPS62510 THERMAL METRIC(1) DRC [VSON] UNIT 10 PINS RθJA Junction-to-ambient thermal resistance 48.5 °C/W RθJC(top) Junction-to-case (top) thermal resistance 71.2 °C/W RθJB Junction-to-board thermal resistance 23.0 °C/W ψJT Junction-to-top characterization parameter 2.1 °C/W ψJB Junction-to-board characterization parameter 23.1 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 4.7 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2006–2015, Texas Instruments Incorporated Product Folder Links: TPS62510 |
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