42X (0.97)

42X (0.95)

(1.17) TYP

(1.15) TYP

(0.48) TYP

(6.9)

(5.08)

(R

) TYP

0.05

2X (3.82)

2X (1.05)

SYMM

PKG

0.07 MAX

ALL AROUND

0.07 MIN

ALL AROUND

(7.48)

(8.55)

2X (3.82)

2X (1.05)

(3.4)

(6.9)

(5.08)

(R

) TYP

0.05

PKG

SYMM

PKG

OPENING

SOLDER MASK

METAL

NON SOLDER MASK

DEFINED

SOLDER MASK

OPENING

SOLDER MASK

METAL UNDER

SOLDER MASK

DEFINED

CSD19532KTT

www.ti.com

SLPS553 – OCTOBER 2015

7.2 Recommended PCB Pattern

For recommended circuit layout for PCB designs, see application note SLPA005 – Reducing Ringing Through

PCB Layout Techniques.

7.3 Recommended Stencil Opening (0.125 mm Stencil Thickness)

Notes:

1. This package is designed to be soldered to a thermal pad on the board. See application notes, PowerPAD

Thermally Enhanced Package (SLMA002) and PowerPAD Made Easy (SLMA004) for more information.

2. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525

may have alternate design recommendations.

3. Board assembly site may have different recommendations for stencil design.

Copyright © 2015, Texas Instruments Incorporated

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