1

GND

8

OUT

2

IN

7

OUT

3

IN

6

OUT

4

EN/EN

5

FLT

1

GND

8

OUT

2

IN

7

OUT

3

IN

6

OUT

4

EN/EN

5

FLT

PowerPAD

4

TPS2000C, TPS2001C, TPS2041C, TPS2051C, TPS2061C

TPS2065C, TPS2065C-2, TPS2068C, TPS2069C, TPS2069C-2

SLVSAU6H – JUNE 2011 – REVISED APRIL 2016

www.ti.com

Product Folder Links: TPS2000C TPS2001C TPS2041C TPS2051C TPS2061C TPS2065C TPS2065C-2 TPS2068C

TPS2069C TPS2069C-2

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Copyright © 2011–2016, Texas Instruments Incorporated

(1)

For the most current packaging and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

(2)

"–" indicates the device is not available in this package.

5 Device Comparison Table

MAXIMUM

OPERATING

CURRENT

OUTPUT

DISCHARGE

ENABLE

BASE PART

NUMBER

MSOP-8 (DGN)

PowerPAD™

SOT23-5

(DBV)

VSSOP-8

(DGK)

0.5

Y

Low

TPS2041C

PYJI

—

0.5

Y

High

TPS2051C

—

VBYQ

—

1

Y

Low

TPS2061C

PXMI

PXLI

—

1

Y

High

TPS2065C

VCAQ

VCAQ

—

1

N

High

TPS2065C-2

PYRI

PYQI

—

1.5

Y

Low

TPS2068C

PXNI

—

—

1.5

Y

High

TPS2069C

VBUQ

PYKI

—

1.5

N

High

TPS2069C-2

PYSI

—

—

2

Y

Low

TPS2000C

BCMS

—

PXFI

2

Y

High

TPS2001C

VBWQ

–

PXGI

6 Pin Configuration and Functions

DGN Package

8-Pin MSOP-PowerPAD

Top View

DGK Package

8-Pin VSSOP

Top View

Pin Functions - 8 Pins

PIN

I/O

DESCRIPTION

NAME

NO.

EN/EN

4

I

Enable input, logic high turns on power switch

FLT

5

O

Active-low open-drain output, asserted during overcurrent, or overtemperature conditions

GND

1

—

Ground connection

IN

2, 3

PWR

Input voltage and power-switch drain; connect a 0.1-µF or greater ceramic capacitor from IN to

GND close to the IC

OUT

6, 7, 8

PWR

Power-switch output, connect to load

PowerPAD

(DGN Only)

PowerPAD

—

Internally connected to GND. Connect PAD to GND plane as a heatsink for the best thermal

performance. PAD may be left floating if desired. See Power Dissipation and Junction

Temperature for guidance.